Issued Patents All Time
Showing 151–175 of 219 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497668 | Integrated fan-out package including voltage regulators and methods forming same | Chen-Hua Yu, Chih-Yuan Chang, Jeng-Shien Hsieh | 2019-12-03 |
| 10498009 | 3D antenna for integrated circuits | Jeng-Shien Hsieh, Chung-Hao Tsai, Chen-Hua Yu | 2019-12-03 |
| 10481351 | Semicondcutor packages | Jeng-Shien Hsieh, Hsing-Kuo Hsia, Chen-Hua Yu | 2019-11-19 |
| 10475755 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Hao-Yi Tsai, Chen-Hua Yu, Wei-Ting Chen +2 more | 2019-11-12 |
| 10461799 | Integrated transmitter and receiver front end module, transceiver, and related method | En-Hsiang Yeh, Monsen Liu | 2019-10-29 |
| 10381309 | Package structure having connecting module | Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu +2 more | 2019-08-13 |
| 10371893 | Hybrid interconnect device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Yu-Kuang Liao, Chih-Chieh Chang | 2019-08-06 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chao-Wen Shih, Han-Ping Pu +5 more | 2019-07-30 |
| 10332841 | System on integrated chips and methods of forming the same | Chen-Hua Yu | 2019-06-25 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10304790 | Method of fabricating an integrated fan-out package | Shou-Zen Chang, Chung-Hao Tsai, Kai-Chiang Wu, Ming-Kai Liu | 2019-05-28 |
| 10297925 | Semiconductor device including integrated fan out antenna and method of forming the same | Jeng-Shieh Hsieh, Chung-Hao Tsai, Monsen Liu, Chen-Hua Yu | 2019-05-21 |
| 10276401 | 3D shielding case and methods for forming the same | Monsen Liu, Lai Wei Chih, Chen-Hua Yu | 2019-04-30 |
| 10270172 | Embedding low-k materials in antennas | Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh | 2019-04-23 |
| 10269728 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chih-Yuan Chang | 2019-04-23 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-04-23 |
| 10267990 | Hybrid interconnect device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Yu-Kuang Liao, Chih-Chieh Chang | 2019-04-23 |
| 10269732 | Info package with integrated antennas or inductors | Chen-Hua Yu | 2019-04-23 |
| 10163824 | Integrated fan-out package and method of fabricating the same | Shou-Zen Chang, Chung-Hao Tsai, Kai-Chiang Wu, Ming-Kai Liu | 2018-12-25 |
| 10163852 | Integrated fan-out package including voltage regulators and methods forming same | Chen-Hua Yu, Chih-Yuan Chang, Jeng-Shien Hsieh | 2018-12-25 |
| 10163854 | Package structure and method for manufacturing thereof | Kai-Chiang Wu, Chieh-Yen Chen, Yen-Ping Wang, Shou-Zen Chang | 2018-12-25 |
| 10163751 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chih-Yuan Chang, Eric Soenen, Chih-Lin Chen | 2018-12-25 |
| 10162139 | Semicondcutor package | Jeng-Shien Hsieh, Hsing-Kuo Hsia, Chen-Hua Yu | 2018-12-25 |
| 10157791 | Through-vias and methods of forming the same | Chung-Hao Tsai, En-Hsiang Yeh | 2018-12-18 |
| 10157834 | Electronic apparatus | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2018-12-18 |