Issued Patents All Time
Showing 201–219 of 219 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9537205 | 3D antenna for integrated circuits | Jeng-Shieh Hsieh, Chung-Hao Tsai, Chen-Hua Yu | 2017-01-03 |
| 9431369 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chen-Hua Yu | 2016-08-30 |
| 9406648 | Power supply arrangement for semiconductor device | Monsen Liu, Sen-Kuei Hsu, Chen-Hua Yu | 2016-08-02 |
| 9407184 | Energy harvesting device | En-Hsiang Yeh, Monsen Liu | 2016-08-02 |
| 9396300 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Monsen Liu, Chen-Hua Yu | 2016-07-19 |
| 9391350 | RF choke device for integrated circuits | Jeng-Shien Hsieh, Monsen Liu, Chung-Hao Tsai, Lai Wei Chih, Yeh En-Hsiang +1 more | 2016-07-12 |
| 9373605 | DIE packages and methods of manufacture thereof | Chen-Hua Yu | 2016-06-21 |
| 9368454 | Semiconductor device with shielding layer in post-passivation interconnect structure | Chung-Hao Tsai, Wei-Chih Lai, Chen-Hua Yu | 2016-06-14 |
| 9355956 | Inductor for semiconductor integrated circuit | Hao-Hsiang Chuang, Jeng-Shien Hsieh, Chen-Hua Yu | 2016-05-31 |
| 9337073 | 3D shielding case and methods for forming the same | Monsen Liu, Lai Wei Chih, Chen-Hua Yu | 2016-05-10 |
| 9331018 | Semiconductor arrangement and formation thereof | Chung-Hao Tsai, Jeng-Shien Hsieh, Chen-Hua Yu | 2016-05-03 |
| 9275950 | Bead for 2.5D/3D chip packaging application | Feng-Wei Kuo, Huan-Neng Chen, Chewn-Pu Jou, Der-Chyang Yeh | 2016-03-01 |
| 9252491 | Embedding low-k materials in antennas | Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh | 2016-02-02 |
| 9082761 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2015-07-14 |
| 9018757 | Mechanisms for forming bump structures over wide metal pad | Chung-Hao Tsai, Chen-Hua Yu | 2015-04-28 |
| 8916979 | Through-vias and methods of forming the same | Chung-Hao Tsai, En-Hsiang Yeh | 2014-12-23 |
| 8872312 | EMI package and method for making same | Der-Chyang Yeh | 2014-10-28 |
| 7312518 | Miniaturized multi-chip module and method for manufacturing the same | Kuo-Hsien Liao, Jia-Yang Chen | 2007-12-25 |
| 7106259 | Planar inverted-F antenna | Kuo-Hua Tseng, Kuan-Hsing Li, Hui-Chung Lee | 2006-09-12 |