Issued Patents All Time
Showing 76–100 of 448 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7625694 | Selective provision of a diblock copolymer material | Eugene P. Marsh, Daryl C. New | 2009-12-01 |
| 7625795 | Container capacitor structure and method of formation thereof | D. Mark Durcan, Roger Lee, Fernando Gonzalez, Er-Xuan Ping | 2009-12-01 |
| 7588677 | Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate | Whonchee Lee, Scott Meikle, Scott E. Moore | 2009-09-15 |
| 7579235 | Container capacitor structure and method of formation thereof | D. Mark Durcan, Roger Lee, Fernando Gonzalez, Er-Xuan Ping | 2009-08-25 |
| 7576012 | Atomic layer deposition methods | Guy T. Blalock, Gurtej S. Sandhu | 2009-08-18 |
| 7569485 | Method for an integrated circuit contact | Charles H. Dennison | 2009-08-04 |
| 7563625 | Method of making light-emitting diodes (LEDs) with improved light extraction by roughening | Chuong Anh Tran, Chen-Fu Chu, Hao-Chun Cheng, Feng-Hsu Fan | 2009-07-21 |
| 7563666 | Semiconductor structures including vertical diode structures and methods of making the same | Fernando Gonzalez, Tyler Lowrey, Raymond A. Turi, Graham R. Wolstenholme | 2009-07-21 |
| 7530153 | Attaching components of a carrier head | Jeffrey P. Schmidt, Douglas R. McAllister, Stacy Meyer | 2009-05-12 |
| 7528430 | Electronic systems | Shenlin Chen, Guy T. Blalock, Lyle Breiner, Er-Xuan Ping | 2009-05-05 |
| 7504008 | Refurbishment of sputtering targets | Kenny King-Tai Ngan | 2009-03-17 |
| 7485961 | Approach to avoid buckling in BPSG by using an intermediate barrier layer | Randhir P. S. Thakur, Yauh-Ching Liu | 2009-02-03 |
| 7482702 | Semiconductor component sealed on five sides by polymer sealing layer | Warren M. Farnworth, Alan G. Wood | 2009-01-27 |
| 7473582 | Method for fabricating semiconductor component with thinned substrate having pin contacts | Alan G. Wood | 2009-01-06 |
| 7473936 | Light emitting diodes (LEDs) with improved light extraction by roughening | Chuong Anh Tran | 2009-01-06 |
| 7470344 | Chemical dispensing system for semiconductor wafer processing | — | 2008-12-30 |
| 7465406 | Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly | Guy T. Blalock | 2008-12-16 |
| 7452739 | Method of separating semiconductor dies | Chen-Fu Chu, Hao-Chun Cheng, Feng-Hsu Fan, Fu-Hsien Wang | 2008-11-18 |
| 7446393 | Co-sputter deposition of metal-doped chalcogenides | Jiutao Li, Allen McTeer, Gregory Herdt | 2008-11-04 |
| 7432600 | System having semiconductor component with multiple stacked dice | Dean A. Klein, Alan G. Wood | 2008-10-07 |
| 7432119 | Light emitting diode with conducting metal substrate | — | 2008-10-07 |
| 7432604 | Semiconductor component and system having thinned, encapsulated dice | Warren M. Farnworth, Alan G. Wood | 2008-10-07 |
| 7431773 | Atomic layer deposition apparatus and method | Gurtej S. Sandhu | 2008-10-07 |
| 7422635 | Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces | Lingyi A. Zheng, Lyle Breiner, Er-Xuan Ping, Kevin L. Beaman, Ronald A. Weimer +2 more | 2008-09-09 |
| 7417325 | Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts | Warren M. Farnworth, Alan G. Wood | 2008-08-26 |