| 8802469 |
Method of fabricating semiconductor die using handling layer |
Chen-Fu Chu, Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan |
2014-08-12 |
| 8716041 |
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths |
Trung T. Doan, Chen-Fu Chu, Wen-Huang Liu, Feng-Hsu Fan, Hao-Chun Cheng |
2014-05-06 |
| 8552458 |
Side by side light emitting diode (LED) having separate electrical and heat transfer paths |
Trung T. Doan, Chen-Fu Chu, Wen-Huang Liu, Feng-Hsu Fan, Hao-Chun Cheng |
2013-10-08 |
| 7968379 |
Method of separating semiconductor dies |
Chen-Fu Chu, Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan |
2011-06-28 |
| 7452739 |
Method of separating semiconductor dies |
Chen-Fu Chu, Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan |
2008-11-18 |