| 12426410 |
Semiconductor components and semiconductor structures and methods of fabrication |
Trung T. Doan, Shih-Kai Chan, David Trung Doan, Yi-Feng Shih |
2025-09-23 |
|
| 12317659 |
Method of making a packaged device |
Trung T. Doan |
2025-05-27 |
|
| 11862755 |
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate |
Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan, Yoshinori Ogawa +7 more |
2024-01-02 |
|
| 11862754 |
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate |
Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan, Yoshinori Ogawa +7 more |
2024-01-02 |
$134,000 |
| 11417799 |
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate |
Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan, Yoshinori Ogawa +7 more |
2022-08-16 |
$260,000 |
| 11005018 |
Semiconductor continuous array layer |
— |
2021-05-11 |
|
| 10910350 |
Structure of a semiconductor array |
Chen-Hsien Chu |
2021-02-02 |
|
| 10862013 |
Light emitting diode device having electrode with low illumination side and high illumination side |
Wen-Huang Liu, Li-Wei Shan |
2020-12-08 |
$283,000 |
| 10797188 |
Optical semiconductor structure for emitting light through aperture |
— |
2020-10-06 |
|
| 10205055 |
Light engine array |
Chen-Hsien Chu |
2019-02-12 |
|
| 10170671 |
Methods of filling a flowable material in a gap of an assembly module |
— |
2019-01-01 |
|
| 9831387 |
Light engine array |
Chen-Hsien Chu |
2017-11-28 |
|
| 9343620 |
Method for fabricating a light emitting diode (LED) die having protective substrate |
Jiunn-Yi Chu, Chao-Chen Cheng |
2016-05-17 |
$59,000 |
| 9130114 |
Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication |
Hao-Chung Cheng, Feng-Hsu Fan, Wen-Huang Liu, Chao-Chen Cheng, David Trung Doan +1 more |
2015-09-08 |
$308,000 |
| 8933467 |
Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC) |
Trung T. Doan, Tien Wei Tan, Wen-Huang Liu, Yung-Wei Chen |
2015-01-13 |
$520,000 |
| 8921204 |
Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses |
Hao-Chung Cheng, Trung T. Doan, Feng-Hsu Fan |
2014-12-30 |
$591,000 |
| 8871547 |
Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate |
Wen-Huang Liu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan +1 more |
2014-10-28 |
$241,000 |
| D715234 |
Flip chip |
Hsun-Cheng Chan, Hao-Chun Cheng |
2014-10-14 |
|
| 8802469 |
Method of fabricating semiconductor die using handling layer |
Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan, Fu-Hsien Wang |
2014-08-12 |
$199,000 |
| 8802465 |
Method for handling a semiconductor wafer assembly |
Trung T. Doan |
2014-08-12 |
$199,000 |
| 8778780 |
Method for defining semiconductor devices |
Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan |
2014-07-15 |
$499,000 |
| 8723160 |
Light emitting diode (LED) die having peripheral electrode frame and method of fabrication |
Feng-Hsu Fan, Hao-Chun Cheng, Trung T. Doan |
2014-05-13 |
$301,000 |
| 8716041 |
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths |
Trung T. Doan, Wen-Huang Liu, Feng-Hsu Fan, Hao-Chun Cheng, Fu-Hsien Wang |
2014-05-06 |
$296,000 |
| 8703515 |
Method for guiding current in a light emitting diode (LED) device |
Wen-Huang Liu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan +1 more |
2014-04-22 |
$682,000 |
| 8686461 |
Light emitting diode (LED) die having stepped substrates and method of fabrication |
Jiunn-Yi Chu, Chao-Chen Cheng |
2014-04-01 |
$385,000 |