Issued Patents All Time
Showing 25 most recent of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426410 | Semiconductor components and semiconductor structures and methods of fabrication | Trung T. Doan, Shih-Kai Chan, David Trung Doan, Yi-Feng Shih | 2025-09-23 |
| 12317659 | Method of making a packaged device | Trung T. Doan | 2025-05-27 |
| 11862755 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan, Yoshinori Ogawa +7 more | 2024-01-02 |
| 11862754 | Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate | Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan, Yoshinori Ogawa +7 more | 2024-01-02 |
| 11417799 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan, Yoshinori Ogawa +7 more | 2022-08-16 |
| 11005018 | Semiconductor continuous array layer | — | 2021-05-11 |
| 10910350 | Structure of a semiconductor array | Chen-Hsien Chu | 2021-02-02 |
| 10862013 | Light emitting diode device having electrode with low illumination side and high illumination side | Wen-Huang Liu, Li-Wei Shan | 2020-12-08 |
| 10797188 | Optical semiconductor structure for emitting light through aperture | — | 2020-10-06 |
| 10205055 | Light engine array | Chen-Hsien Chu | 2019-02-12 |
| 10170671 | Methods of filling a flowable material in a gap of an assembly module | — | 2019-01-01 |
| 9831387 | Light engine array | Chen-Hsien Chu | 2017-11-28 |
| 9343620 | Method for fabricating a light emitting diode (LED) die having protective substrate | Jiunn-Yi Chu, Chao-Chen Cheng | 2016-05-17 |
| 9130114 | Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication | Hao-Chung Cheng, Feng-Hsu Fan, Wen-Huang Liu, Chao-Chen Cheng, David Trung Doan +1 more | 2015-09-08 |
| 8933467 | Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC) | Trung T. Doan, Tien Wei Tan, Wen-Huang Liu, Yung-Wei Chen | 2015-01-13 |
| 8921204 | Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses | Hao-Chung Cheng, Trung T. Doan, Feng-Hsu Fan | 2014-12-30 |
| 8871547 | Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate | Wen-Huang Liu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan +1 more | 2014-10-28 |
| D715234 | Flip chip | Hsun-Cheng Chan, Hao-Chun Cheng | 2014-10-14 |
| 8802469 | Method of fabricating semiconductor die using handling layer | Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan, Fu-Hsien Wang | 2014-08-12 |
| 8802465 | Method for handling a semiconductor wafer assembly | Trung T. Doan | 2014-08-12 |
| 8778780 | Method for defining semiconductor devices | Trung T. Doan, Hao-Chun Cheng, Feng-Hsu Fan | 2014-07-15 |
| 8723160 | Light emitting diode (LED) die having peripheral electrode frame and method of fabrication | Feng-Hsu Fan, Hao-Chun Cheng, Trung T. Doan | 2014-05-13 |
| 8716041 | Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths | Trung T. Doan, Wen-Huang Liu, Feng-Hsu Fan, Hao-Chun Cheng, Fu-Hsien Wang | 2014-05-06 |
| 8703515 | Method for guiding current in a light emitting diode (LED) device | Wen-Huang Liu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan +1 more | 2014-04-22 |
| 8686461 | Light emitting diode (LED) die having stepped substrates and method of fabrication | Jiunn-Yi Chu, Chao-Chen Cheng | 2014-04-01 |