Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths

Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths

US Patent 8716041 · Granted May 6, 2014

Estimated economic value: $296,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor components and semiconductor structures and methods of fabrication2025
Semiconductor components and semiconductor structures and methods of fabrication2025
Method for making light emitting device (LED) arrays and electronic products usi2025
Emergency protection system for UPS2025
Method of making a packaged device2025
Method of making a packaged device2025
Light emitting diode (LED) structure having single epitaxial structure separated2025
Method for making electronic device arrays using a temporary substrate2025
Energy-saving operation and control method for UPS2024
Large-scale low-temperature controllable atmospheric boundary layer test system 2024
Scooter2024
Method for suppressing overshooting of output voltage or output current, chargin2024