Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Light emitting diode (LED) die having stepped substrates and method of fabrication

Light emitting diode (LED) die having stepped substrates and method of fabrication

US Patent 8686461 · Granted Apr 1, 2014

Estimated economic value: $385,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor components and semiconductor structures and methods of fabrication2025
Alignment method for backside photolithography process2025
Method of making a packaged device2025
Semiconductor laser chip and preparation method therefor2025
Manufacturing method for laser chip and laser chip2024
Semiconductor laser and fabrication method therefor2024
Method for fabricating (LED) dice using semiconductor structures on a substrate 2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a rec2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a rec2022
Semiconductor continuous array layer2021
Structure of a semiconductor array2021
Light emitting diode device having electrode with low illumination side and high2020