Issued Patents All Time
Showing 126–150 of 448 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7247944 | Connector assembly | — | 2007-07-24 |
| 7247581 | Methods for treating pluralities of discrete semiconductor substrates | Lyle Breiner, Er-Xuan Ping, Lingyi A. Zheng | 2007-07-24 |
| 7235138 | Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces | Lingyi A. Zheng, Lyle Breiner, Er-Xuan Ping, Ronald A. Weimer, David J. Kubista +2 more | 2007-06-26 |
| 7224065 | Contact/via force fill techniques and resulting structures | — | 2007-05-29 |
| 7221059 | Wafer level semiconductor component having thinned, encapsulated dice and polymer dam | Warren M. Farnworth, Alan G. Wood | 2007-05-22 |
| 7220670 | Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same | Gurtej S. Sandhu | 2007-05-22 |
| 7220312 | Methods for treating semiconductor substrates | Lyle Breiner, Er-Xuan Ping, Lingyi A. Zheng | 2007-05-22 |
| 7202104 | Co-sputter deposition of metal-doped chalcogenides | Jiutao Li, Allen McTeer, Gregory Herdt | 2007-04-10 |
| 7195944 | Systems and methods for producing white-light emitting diodes | Chuong Anh Tran | 2007-03-27 |
| 7186580 | Light emitting diodes (LEDs) with improved light extraction by roughening | Chuong Anh Tran | 2007-03-06 |
| 7183208 | Methods for treating pluralities of discrete semiconductor substrates | Lyle Breiner, Er-Xuan Ping, Lingyi A. Zheng | 2007-02-27 |
| 7170103 | Wafer with vertical diode structures | Fernando Gonzalez, Tyler Lowrey, Raymond A. Turi, Graham R. Wolstenholme | 2007-01-30 |
| 7169691 | Method of fabricating wafer-level packaging with sidewall passivation and related apparatus | — | 2007-01-30 |
| 7166875 | Vertical diode structures | Fernando Gonzalez, Tyler Lowrey, Raymond A. Turi, Graham R. Wolstenholme | 2007-01-23 |
| 7160785 | Container capacitor structure and method of formation thereof | D. Mark Durcan, Roger Lee, Fernando Gonzalez | 2007-01-09 |
| 7157353 | Method for fabricating encapsulated semiconductor components | Warren M. Farnworth, Alan G. Wood | 2007-01-02 |
| 7153410 | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces | Scott E. Moore, Whonchee Lee, Scott Meikle | 2006-12-26 |
| 7132731 | Semiconductor component and assembly having female conductive members | Alan G. Wood | 2006-11-07 |
| 7122906 | Die-wafer package and method of fabricating same | — | 2006-10-17 |
| 7115529 | Atomic layer deposition methods | Guy T. Blalock, Gurtej S. Sandhu | 2006-10-03 |
| 7112121 | Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate | Whonchee Lee, Scott Meikle, Scott E. Moore | 2006-09-26 |
| 7112544 | Method of atomic layer deposition on plural semiconductor substrates simultaneously | Lyle Breiner, Er-Xuan Ping, Lingyi A. Zheng | 2006-09-26 |
| 7101594 | Methods of forming capacitor constructions | Gurtej S. Sandhu | 2006-09-05 |
| 7097782 | Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly | Guy T. Blalock | 2006-08-29 |
| 7081665 | Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts | Alan G. Wood | 2006-07-25 |