Issued Patents All Time
Showing 26–50 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6991709 | Multi-step magnetron sputtering process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Wei Wang +1 more | 2006-01-31 |
| 6962883 | Integrated circuit insulator and method | Somnath Nag, Srikanth Krishnan | 2005-11-08 |
| 6951599 | Electropolishing of metallic interconnects | Joseph Yahalom, Deenesh Padhi, Srinivas Gandikota | 2005-10-04 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition | Bo Zheng, Hougong Wang, Fusen Chen | 2005-07-05 |
| 6905622 | Electroless deposition method | Deenesh Padhi, Joseph Yahalom, Sivakami Ramanathan, Chris McGuirk, Srinivas Gandikota | 2005-06-14 |
| 6899816 | Electroless deposition method | Deenesh Padhi, Joseph Yahalom, Sivakami Ramanathan, Chris McGuirk, Srinivas Gandikota | 2005-05-31 |
| 6878245 | Method and apparatus for reducing organic depletion during non-processing time periods | Srinivas Gandikota, Chris McGuirk, Deenesh Padhi, Sivakami Ramanathan, Muhammad Malik | 2005-04-12 |
| 6869516 | Method for removing electrolyte from electrical contacts and wafer touching areas | Dmitry Lubomirsky, Michael Yang, Vincent E. Burkhart, Allen L. D'Ambra, Yeuk-Fai Edwin Mok +1 more | 2005-03-22 |
| 6824666 | Electroless deposition method over sub-micron apertures | Srinivas Gandikota, Chris McGuirk, Deenesh Padhi, Muhammad Malik, Sivakami Ramanathan +1 more | 2004-11-30 |
| 6824612 | Electroless plating system | Joseph Stevens, Dmitry Lubomirsky, Ian Pancham, Donald Olgado, Howard Grunes +1 more | 2004-11-30 |
| 6821909 | Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application | Sivakami Ramanathan, Deenesh Padhi, Srinivas Gandikota | 2004-11-23 |
| 6808611 | Methods in electroanalytical techniques to analyze organic components in plating baths | Zhi-Wen Sun, Chunman Yu, Brian Metzger, David Nguyen | 2004-10-26 |
| 6797620 | Method and apparatus for improved electroplating fill of an aperture | John Lewis, Srinivas Gandikota, Sivakami Ramanathan, Robin Cheung, Fusen Chen | 2004-09-28 |
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Wei Wang +1 more | 2004-09-07 |
| 6773569 | Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives | Zhi-Wen Sun, Nicolay Kovarsky, Chunman Yu | 2004-08-10 |
| 6746591 | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature | Bo Zheng, Renren He | 2004-06-08 |
| 6617242 | Method for fabricating interlevel contacts of aluminum/refractory metal alloys | Fusen Chen, Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Yih-Shung Lin | 2003-09-09 |
| 6610189 | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature | Hougong Wang, Bo Zheng, Fusen Chen | 2003-08-26 |
| 6589352 | Self aligning non contact shadow ring process kit | Joseph Yudovsky, Lawrence Chung-Lai Lei, Salvador P. Umotoy, Tom Madar, Gwo-Chuan Tzu | 2003-07-08 |
| 6589865 | Low pressure, low temperature, semiconductor gap filling process | Anthony Konecni, Robert H. Havemann | 2003-07-08 |
| 6566258 | Bi-layer etch stop for inter-level via | Fusen Chen | 2003-05-20 |
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6358849 | Integrated circuit interconnect and method | Robert H. Havemann, Manoj Kumar Jain, Eden Zielinski, Qi-Zhong Hong, Jeffrey Alan West | 2002-03-19 |
| 6355559 | Passivation of inlaid metallization | Robert H. Havemann, Qi-Zhong Hong | 2002-03-12 |