Issued Patents All Time
Showing 51–75 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6355558 | Metallization structure, and associated method, to improve crystallographic texture and cavity fill for CVD aluminum/PVD aluminum alloy films | Anthony Konecni | 2002-03-12 |
| 6333265 | Low pressure, low temperature, semiconductor gap filling process | Anthony Konecni, Robert H. Havemann | 2001-12-25 |
| 6303452 | Method for making transistor spacer etch pinpoint structure | Fusen Chen, Frank R. Bryant | 2001-10-16 |
| 6297125 | Air-bridge integration scheme for reducing interconnect delay | Somnath Nag, Amitava Chatterjee | 2001-10-02 |
| 6287963 | Method for forming a metal contact | Fusen Chen, Fu-Tai Liou, Che-Chia Wei | 2001-09-11 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Sankaram Athreya +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Praburam Gopalraja, Jianming Fu, Fusen Chen, Zheng Xu, Sankaram Athreya +2 more | 2001-08-14 |
| 6268297 | Self-planarizing low-temperature doped-silicate-glass process capable of gap-filling narrow spaces | Somnath Nag, Gregory B. Shinn | 2001-07-31 |
| 6251771 | Hydrogen passivation of chemical-mechanically polished copper-containing layers | Patricia B. Smith, Eden Zielinski, Stephen W. Russell | 2001-06-26 |
| 6242811 | Interlevel contact including aluminum-refractory metal alloy formed during aluminum deposition at an elevated temperature | Fusen Chen, Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Yih-Shung Lin | 2001-06-05 |
| 6194313 | Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback process | Abha Singh, Wei-Yung Hsu, Guoqiang Xing | 2001-02-27 |
| 6159847 | Multilayer metal structure for improved interconnect reliability | Robert H. Havemann | 2000-12-12 |
| 6130156 | Variable doping of metal plugs for enhanced reliability | Robert H. Havemann, Stephen W. Russell | 2000-10-10 |
| 6069072 | CVD tin barrier layer for reduced electromigration of aluminum plugs | Anthony Konecni | 2000-05-30 |
| 5930673 | Method for forming a metal contact | Fusen Chen, Fu-Tai Liou, Yih-Shung Lin, Che-Chia Wei | 1999-07-27 |
| 5856233 | Method of forming a field programmable device | Frank R. Bryant, Fusen Chen | 1999-01-05 |
| 5849367 | Elemental titanium-free liner and fabrication process for inter-metal connections | Anthony Konecni | 1998-12-15 |
| 5847457 | Structure and method of forming vias | Fusen Chen, Fu-Tai Liou | 1998-12-08 |
| 5759869 | Method to imporve metal step coverage by contact reflow | Fusen Chen, Frank R. Bryant | 1998-06-02 |
| 5593921 | Method of forming vias | Fusen Chen, Fu-Tai Liou | 1997-01-14 |
| 5582971 | Method of forming submicron contacts | Fusen Chen, Robert O. Miller | 1996-12-10 |
| 5578872 | Planar contact with a void | Fusen Chen, Robert O. Miller | 1996-11-26 |
| 5571752 | Method of forming a planar contact with a void | Fusen Chen, Robert O. Miller | 1996-11-05 |
| 5523624 | Integrated circuit device structure with dielectric and metal stacked plug in contact hole | Fusen Chen, Robert O. Miller | 1996-06-04 |
| 5521411 | Transistor spacer etch pinpoint structure | Fusen Chen, Frank R. Bryant | 1996-05-28 |