Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334354 | Sidewall passivation for plasma etching | Zhonghua Yao, Aaron Eppler, Mukund Srinivasan | 2025-06-17 |
| 12315733 | Enhanced etch selectivity using halides | David Knapp, Feng Qiao, Hailong Zhou, Junkai He, Mark Saly +2 more | 2025-05-27 |
| 12198928 | Carbon gap fill processes | Abhijeet S. Bagal | 2025-01-14 |
| 12165872 | Methods and systems for advanced ion control for etching processes | Zhongkui Tan, Ying Wu, Qing Xu, John Drewery | 2024-12-10 |
| 12148475 | Selection gate separation for 3D NAND | Chang-Seok Kang, Tomohiko Kitajima, Gill Yong Lee, Sung-Kwan Kang, Takehito Koshizawa +1 more | 2024-11-19 |
| 12125699 | Selective carbon deposition on top and bottom surfaces of semiconductor substrates | Abhijeet S. Bagal, Kuan-Ting Liu, Chung Liu | 2024-10-22 |
| 12106972 | Selective silicon deposition | Yifeng Zhou | 2024-10-01 |
| 12009218 | Pulsed etch process | Yifeng Zhou | 2024-06-11 |
| 11935751 | Boron nitride for mask patterning | Siyu Zhu, Chuanxi Yang, Hang Yu, Deenesh Padhi, Yeonju Kwak +2 more | 2024-03-19 |
| 11798785 | Systems for reverse pulsing | Maolin Long, Zhongkui Tan, Ying Wu, Alex Paterson, John Drewery | 2023-10-24 |
| 11646207 | Silicon oxide silicon nitride stack stair step etch | Ce Qin, Zhongkui Tan, Sam Do Lee | 2023-05-09 |
| 11049726 | Methods and systems for advanced ion control for etching processes | Zhongkui Tan, Ying Wu, Qing Xu, John Drewery | 2021-06-29 |
| 10943789 | Methods and systems for advanced ion control for etching processes | Zhongkui Tan, Ying Wu, Qing Xu, John Drewery | 2021-03-09 |
| 10763142 | System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter | Marcus Musselman, Juan Valdivia, Hua Xiang, Andrew D. Bailey, III, Yoko Yamaguchi +1 more | 2020-09-01 |
| 10658194 | Silicon-based deposition for semiconductor processing | Zhongkui Tan, Qing Xu, Hua Xiang, Lin Zhao | 2020-05-19 |
| 10446394 | Spacer profile control using atomic layer deposition in a multiple patterning process | Mirzafer Abatchev, Yoko Yamaguchi, Aaron Eppler | 2019-10-15 |
| 10354888 | Method and apparatus for anisotropic tungsten etching | Zhongkui Tan, Huai-Yu Hsiao | 2019-07-16 |
| 10242845 | Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber | Zhongkui Tan, Yiting Zhang, Qing Xu, Ying Wu, Saravanapriyan Sriraman +1 more | 2019-03-26 |
| 10177003 | Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level | Zhongkui Tan, Ying Wu, Qing Xu, Hua Xiang | 2019-01-08 |
| 10020183 | Edge roughness reduction | Yansha Jin, Zhongkui Tan, Lin Cui, Martin Shim | 2018-07-10 |
| 9997366 | Silicon oxide silicon nitride stack ion-assisted etch | Zhongkui Tan, Hua Xiang, Wenbing Hu, Qing Xu | 2018-06-12 |
| 9991128 | Atomic layer etching in continuous plasma | Zhongkui Tan, Yiting Zhang, Ying Wu, Qing Xu, Yoko Yamaguchi +1 more | 2018-06-05 |
| 9941123 | Post etch treatment to prevent pattern collapse | Mirzafer Abatchev, Yasushi Ishikawa | 2018-04-10 |
| 9859127 | Line edge roughness improvement with photon-assisted plasma process | Zhongkui Tan, Qing Xu, Sangjun Park | 2018-01-02 |
| 9852924 | Line edge roughness improvement with sidewall sputtering | Zhongkui Tan, Hua Xiang, Yiting Zhang, Qing Xu | 2017-12-26 |