Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400363 | Device and method for improved fiducial marker detection | Yi Li, Hong Seung YEON, Wei Li, Raquel DE SOUZA BORGES FERREIRA, Minglu LIU +4 more | 2025-08-26 |
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Thomas HEATON, Steve Cho, Rahul Jain +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Ram Viswanath, Nicholas Neal, Mitul Modi | 2025-03-25 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-09-10 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Vaibhav Agrawal +4 more | 2024-08-20 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Thomas HEATON, Steve Cho, Rahul Jain +5 more | 2024-06-11 |
| 11942393 | Substrate with thermal insulation | Wei Li, Edvin Cetegen, Mitul Modi, Nicholas Neal | 2024-03-26 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-02-13 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Je-Young Chang, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Thomas HEATON, Steve Cho, Rahul Jain, Tarek A. Ibrahim +4 more | 2023-10-03 |
| 11652036 | Via-trace structures | Jeremy Ecton, Hiroki Tanaka, Kristof Darmawikarta, Oscar Ojeda, Arnab Roy | 2023-05-16 |
| 11640929 | Thermal management solutions for cored substrates | Nicholas Neal, Divya Mani | 2023-05-02 |
| 11594463 | Substrate thermal layer for heat spreader connection | Nicholas Neal | 2023-02-28 |
| 11528811 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Oscar Ojeda, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2022-12-13 |
| 11502008 | Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control | Edvin Cetegen, Shankar Devasenathipathy | 2022-11-15 |
| 11116084 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Oscar Ojeda, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2021-09-07 |
| 10576590 | Torque controlled driver apparatus and method | Batsegaw K. Gebrehiwot, Joseph B. Petrini, Shankar Devasenathipathy, Robert L. Sankman, Alfredo Cardona | 2020-03-03 |
| 10553548 | Methods of forming multi-chip package structures | Nicholas Neal | 2020-02-04 |
| 10515824 | Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field | Jeremy Ecton, Leonel Arana, Hsin-Wei Wang, Oscar Ojeda, Arnab Roy | 2019-12-24 |
| 10438812 | Anisotropic etching systems and methods using a photochemically enhanced etchant | Jeremy Ecton, Changhua Liu, Arnab Roy, Oscar Ojeda, Timothy A. White | 2019-10-08 |
| 10428439 | Predictive capability for electroplating shield design | Sashi S. Kandanur | 2019-10-01 |