Issued Patents All Time
Showing 25 most recent of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177131 | Method and apparatuses for reducing porogen accumulation from a UV-cure chamber | Lisa Gytri, Jeff Gordon, James Lee, Carmen Balderrama, Joseph Brett Harris +3 more | 2021-11-16 |
| 10230018 | Substrate used for III-V-nitride growth and manufacturing method thereof | Maosheng Hao, Genru Yuan, Yue Ma | 2019-03-12 |
| 10121682 | Purging of porogen from UV cure chamber | Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian | 2018-11-06 |
| 10020197 | Method for reducing porogen accumulation from a UV-cure chamber | Lisa Gytri, Jeff Gordon, James Lee, Carmen Balderrama, Joseph Brett Harris +3 more | 2018-07-10 |
| 9832493 | Method and apparatus for processing audio/video file | Huaiyin Guo, Xu Zhang | 2017-11-28 |
| 9384959 | Purging of porogen from UV cure chamber | Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian | 2016-07-05 |
| 9073100 | Method and apparatuses for reducing porogen accumulation from a UV-cure chamber | Lisa Gytri, Jeff Gordon, James Lee, Carmen Balderrama, Joseph Brett Harris +3 more | 2015-07-07 |
| 9031685 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more | 2015-05-12 |
| 9012334 | Formation of a tantalum-nitride layer | Sean M. Seutter, Michael Yang | 2015-04-21 |
| 8734663 | Purging of porogen from UV cure chamber | Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian | 2014-05-27 |
| 8626330 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more | 2014-01-07 |
| 8518210 | Purging of porogen from UV cure chamber | Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian | 2013-08-27 |
| 8282768 | Purging of porogen from UV cure chamber | Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian | 2012-10-09 |
| 8123860 | Apparatus for cyclical depositing of thin films | Randhir P. S. Thakur, Alfred Mak, Walter Glenn, Ahmad Khan, Ayad A. Al-Shaikh +2 more | 2012-02-28 |
| 8114789 | Formation of a tantalum-nitride layer | Sean M. Seutter, Michael Yang | 2012-02-14 |
| 8027746 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more | 2011-09-27 |
| 7867914 | System and method for forming an integrated barrier layer | Michael Yang, Hui Zhang | 2011-01-11 |
| 7860597 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more | 2010-12-28 |
| 7781326 | Formation of a tantalum-nitride layer | Sean M. Seutter, Michael Yang | 2010-08-24 |
| 7779784 | Apparatus and method for plasma assisted deposition | Chen-An Chen, Avgerinos V. Gelatos, Michael Yang, Mark Hytros | 2010-08-24 |
| 7745333 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more | 2010-06-29 |
| 7732325 | Plasma-enhanced cyclic layer deposition process for barrier layers | Michael Yang, Toshio Itoh | 2010-06-08 |
| 7709385 | Method for depositing tungsten-containing layers by vapor deposition techniques | Ashok Sinha, Moris Kori, Alfred Mak, Xinliang Lu, Ken Kaung Lai +1 more | 2010-05-04 |
| 7695563 | Pulsed deposition process for tungsten nucleation | Xinliang Lu, Ping Jian, Jong Hyun Yoo, Ken Kaung Lai, Alfred Mak +1 more | 2010-04-13 |
| 7674715 | Method for forming tungsten materials during vapor deposition processes | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2010-03-09 |