Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244917 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2022-02-08 |
| 11171102 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2021-11-09 |
| 11094657 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2021-08-17 |
| 10403590 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2019-09-03 |
| 10396051 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2019-08-27 |
| 9640501 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2017-05-02 |
| 9472520 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2016-10-18 |
| 9379007 | Electromigration-resistant lead-free solder interconnect structures | Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more | 2016-06-28 |
| 9142501 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, Eric D. Perfecto, David J. Russell, Wolfgang Sauter +1 more | 2015-09-22 |
| 9111816 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2015-08-18 |
| 9084378 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, Eric D. Perfecto, Thomas A. Wassick | 2015-07-14 |
| 9035459 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Timothy D. Sullivan | 2015-05-19 |
| 8922019 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Ian D. Melville | 2014-12-30 |
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2014-12-16 |
| 8803317 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Timothy D. Sullivan | 2014-08-12 |
| 8749059 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Ian D. Melville | 2014-06-10 |
| 8741769 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Ian D. Melville | 2014-06-03 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2014-03-18 |
| 8623194 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox | 2014-01-07 |
| 8610283 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Ian D. Melville | 2013-12-17 |
| 8587112 | Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack | Charles L. Arvin, Hai P. Longworth, David J. Russell | 2013-11-19 |
| 8551303 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox | 2013-10-08 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2013-07-23 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2013-05-21 |
| 8298929 | Offset solder vias, methods of manufacturing and design structures | Timothy H. Daubenspeck, Gary LaFontant, Ekta Misra, David L. Questad, George J. Scott +3 more | 2012-10-30 |