| 12272614 |
Integrated circuit packages with solder thermal interface materials with embedded particles |
Amitesh Saha, Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Peng Li |
2025-04-08 |
| 12062592 |
Integrated circuit packages with thermal interface materials with different material compositions |
Sergio Antonio Chan Arguedas, Amitesh Saha, Marco Aurelio Cartas, Emilio Tarango Valles |
2024-08-13 |
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more |
2023-11-28 |
| 11798861 |
Integrated heat spreader (IHS) with heating element |
Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Shenavia S. Howell +3 more |
2023-10-24 |
| 11791237 |
Microelectronic assemblies including a thermal interface material |
Peng Li, Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal |
2023-10-17 |
| 11710677 |
Ultraviolet (UV)-curable sealant in a microelectronic package |
Taylor Gaines, Elah Bozorg-Grayeli |
2023-07-25 |
| 11710672 |
Microelectronic package with underfilled sealant |
Taylor Gaines, Frederick Atadana, Elah Bozorg-Grayeli |
2023-07-25 |
| 11404349 |
Multi-chip packages and sinterable paste for use with thermal interface materials |
Nachiket R. Raravikar, Ravindranath V. Mahajan, Robert L. Sankman, James C. Matayabas, Jr., Nayandeep K. Mahanta +1 more |
2022-08-02 |
| 10515914 |
Sintered solder for fine pitch first-level interconnect (FLI) applications |
Mihir A. Oka, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar |
2019-12-24 |
| 10224299 |
Sintered solder for fine pitch first-level interconnect (FLI) applications |
Mihir A. Oka, Vijay Krishnan SUBRAMANIAN, Neha M. Patel, Nachiket R. Raravikar |
2019-03-05 |