| 11121101 |
Flip chip packaging rework |
Charles L. Arvin, Thomas A. Wassick, Brian W. Quinlan |
2021-09-14 |
| 10957650 |
Bridge support structure |
Charles L. Arvin, Brian W. Quinlan, Thomas Weiss |
2021-03-23 |
| 9947598 |
Determining crackstop strength of integrated circuit assembly at the wafer level |
Krishna R. Tunga, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander, Christopher D. Muzzy +1 more |
2018-04-17 |
| 9401336 |
Dual layer stack for contact formation |
Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Sarah H. Knickerbocker, David J. Russell |
2016-07-26 |
| 9214385 |
Semiconductor device including passivation layer encapsulant |
Brian M. Erwin, Ekta Misra |
2015-12-15 |
| 8937009 |
Far back end of the line metallization method and structures |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Eric D. Perfecto +1 more |
2015-01-20 |
| 5985128 |
Method of performing processes on features with electricity |
Shaji Farooq, Suryanarayana Kaja, Hsichang Liu, Gregg B. Monjeau, Kim H. Ruffing |
1999-11-16 |
| 5935404 |
Method of performing processes on features with electricity |
Shaji Farooq, Suryanarayana Kaja, Hsichang Liu, Gregg B. Monjeau, Kim H. Ruffing |
1999-08-10 |
| 5896869 |
Semiconductor package having etched-back silver-copper braze |
Joseph F. Maniscalco, Krystyna W. Semkow |
1999-04-27 |
| 5869139 |
Apparatus and method for plating pin grid array packaging modules |
Glen N. Biggs, John Di Santis, Paul F. Findeis, Phillip W. Palmatier, Victor M. Vitek |
1999-02-09 |
