Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7468320 | Reduced electromigration and stressed induced migration of copper wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Carlos J. Sambucetti, Anthony K. Stamper | 2008-12-23 |
| 7407605 | Manufacturable CoWP metal cap process for copper interconnects | Darryl D. Restaino, Donald F. Canaperi, Sean Smith, Richard O. Henry, James E. Fluegel +1 more | 2008-08-05 |
| 7259025 | Ferromagnetic liner for conductive lines of magnetic memory cells | Rainer Leuschner, Michael C. Gaidis, Lubomyr T. Romankiw | 2007-08-21 |
| 7253106 | Manufacturable CoWP metal cap process for copper interconnects | Darryl D. Restaino, Donald F. Canaperi, Sean Smith, Richard O. Henry, James E. Fluegel +1 more | 2007-08-07 |
| 7217655 | Electroplated CoWP composite structures as copper barrier layers | Cyril Cabral, Jr., Stefanie Chiras, Emanuel I. Cooper, Hariklia Deligianni, Andrew J. Kellock +1 more | 2007-05-15 |
| 7193323 | Electroplated CoWP composite structures as copper barrier layers | Cyril Cabral, Jr., Stefanie Chiras, Emanuel I. Cooper, Hariklia Deligianni, Andrew J. Kellock +1 more | 2007-03-20 |
| 7081680 | Self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Anthony K. Stamper, Carlos J. Sambucetti | 2006-07-25 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Anthony K. Stamper, Carlos J. Sambucetti | 2004-08-24 |
| 6656750 | Method for testing chips on flat solder bumps | Madhav Datta, Peter A. Gruber, Carlos J. Sambucetti, George F. Walker | 2003-12-02 |
| 6646345 | Method for forming Co-W-P-Au films | Carlos J. Sambucetti, Daniel C. Edelstein, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2003-11-11 |
| 6503834 | Process to increase reliability CuBEOL structures | Xiaomeng Chen, Mahadevaiyer Krishnan, Carlos J. Sambucetti, Soon-Cheon Seo, James A. Tornello | 2003-01-07 |
| 6457234 | Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Carlos J. Sambucetti, Anthony K. Stamper | 2002-10-01 |
| 6342733 | Reduced electromigration and stressed induced migration of Cu wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Carlos J. Sambucetti, Anthony K. Stamper | 2002-01-29 |
| 6339024 | Reinforced integrated circuits | Kevin S. Petrarca, John E. Heidenreich, III, Carlos J. Sambucetti, Richard P. Volant, George F. Walker | 2002-01-15 |
| 6335104 | Method for preparing a conductive pad for electrical connection and conductive pad formed | Carlos J. Sambucetti, Daniel C. Edelstein, John G. Gaudiello, George F. Walker | 2002-01-01 |
| 6323128 | Method for forming Co-W-P-Au films | Carlos J. Sambucetti, Daniel C. Edelstein, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2001-11-27 |
| 6259408 | RFID transponders with paste antennas and flip-chip attachment | Michael John Brady, Dah-Weih Duan, Ravi F. Saraf | 2001-07-10 |