| 12046536 |
Integrated heat spreader with enhanced vapor chamber for multichip packages |
Je-Young Chang, Zhimin Wan, Kyle Arrington |
2024-07-23 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |
| 11189574 |
Microelectronic package having electromagnetic interference shielding |
Li-Sheng Weng, Chung-Hao Chen, Min Keen Tang |
2021-11-30 |
| 10049971 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2018-08-14 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more |
2017-11-14 |
| 9646903 |
Thermoset polymides for microelectronic applications |
Stephen Lehman, Saikumar Jayaraman |
2017-05-09 |
| 9613933 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2017-04-04 |
| 9604210 |
Controlled fluid delivery in a microelectronic package |
Lakshmi Supriya, Nirupama Chakrapani |
2017-03-28 |
| 9101931 |
Controlled fluid delivery in a microelectronic package |
Lakshmi Supriya, Nirupama Chakrapani |
2015-08-11 |
| 8643199 |
Thermoset polyimides for microelectronic applications |
Stephen Lehman, Saikumar Jayaraman |
2014-02-04 |
| 7952212 |
Applications of smart polymer composites to integrated circuit packaging |
Nirupama Chakrapani, Vijay Wakharkar |
2011-05-31 |
| 7611985 |
Formation of holes in substrates using dewetting coatings |
Lakshmi Supriya |
2009-11-03 |
| 7534649 |
Thermoset polyimides for microelectronic applications |
Stephen Lehman, Saikumar Jayaraman |
2009-05-19 |
| 7224050 |
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging |
Leonel Arana, Stephen Lehman |
2007-05-29 |