HS

Harbans S. Sachdev

IBM: 26 patents #4,008 of 70,183Top 6%
NB Nxp B.V.: 1 patents #1,722 of 3,591Top 50%
Overall (All Time): #139,833 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 25 most recent of 28 patents

Patent #TitleCo-InventorsDate
7670961 Reduction of cracking in low-k spin-on dielectric films Howard Shillingford, Garkay Joseph Leung, Mary Matera-Longo, John Rapp 2010-03-02
6635118 Aqueous cleaning of polymer apply equipment Richard A. Cormack, Gerard V. Capogna, Felice J. Mancaruso, Krishna G. Sachdev 2003-10-21
6153696 Process for forming carbonates of hydroxyaromatic compounds Gregory Breyta, Daniel J. Dawson, Moahmoud Mostafa Khojasteh, Ranee W. Kwong, Elwood Herbert Macy +5 more 2000-11-28
5976710 Low TCE polyimides as improved insulator in multilayer interconnect structures Krishna G. Sachdev, John P. Hummel, Sundar M. Kamath, Robert N. Lang, Anton Nendaic +1 more 1999-11-02
5422223 Silicon-containing positive resist and use in multilayer metal structures Krishna G. Sachdev, Joel R. Whitaker 1995-06-06
5399462 Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane Krishna G. Sachdev, Premlatha Jagannathan, Robert N. Lang, Ratnam Sooriyakumaran, Joel R. Whitaker 1995-03-21
5385804 Silicon containing negative resist for DUV, I-line or E-beam lithography comprising an aromatic azide side group in the polysilsesquioxane polymer Jagannathan Premlatha, Ratnam Sooriyakumaran 1995-01-31
5338818 Silicon containing positive resist for DUV lithography William R. Brunsvold, Premlatha Jagannathan, Steve S. Miura, Melvin Montgomery, Ratnam Sooriyakumaran 1994-08-16
5322765 Dry developable photoresist compositions and method for use thereof Nicholas J. Clecak, Willard E. Conley, Ranee W. Kwong, Leo L. Linehan, Scott A. MacDonald +2 more 1994-06-21
5312717 Residue free vertical pattern transfer with top surface imaging resists John C. Forster, Leo L. Linehan, Scott A. MacDonald, K. Paul Muller, Walter E. Mlynko +1 more 1994-05-17
5296332 Crosslinkable aqueous developable photoresist compositions and method for use thereof Willard E. Conley, Premlatha Jagannathan, Ahmad D. Katnani, Ranee W. Kwong, Leo L. Linehan +2 more 1994-03-22
5240812 Top coat for acid catalyzed resists Willard E. Conley, Ranee W. Kwong, Richard J. Kvitek, Robert N. Lang, Christopher F. Lyons +3 more 1993-08-31
5213704 Process for making a compliant thermally conductive compound Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Mark A. Takacs 1993-05-25
5114826 Photosensitive polyimide compositions Ranee W. Kwong, Krishna G. Sachdev 1992-05-19
5115090 Viscosity stable, essentially gel-free polyamic acid compositions Krishna G. Sachdev, John P. Hummel, Ranee W. Kwong, Robert N. Lang, Leo L. Linehan 1992-05-19
5094769 Compliant thermally conductive compound Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Mark A. Takacs 1992-03-10
4978594 Fluorine-containing base layer for multi-layer resist processes James A. Bruce, Michael L. Kerbaugh, Ranee W. Kwong, Tanya N. Lee, Harold G. Linde 1990-12-18
4826564 Method of selective reactive ion etching of substrates Brian H. Desilets, Richard D. Kaplan, Krishna G. Sachdev, Susan Sanchez 1989-05-02
4772346 Method of bonding inorganic particulate material Herbert R. Anderson, Jr., Constance J. Araps, Renuka S. Divakaruni, Daniel P. Kirby, Robert W. Nufer +3 more 1988-09-20
4692205 Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings Krishna G. Sachdev, Ranee W. Kwong, Mani R. Gupta, Mark S. Chace 1987-09-08
4665006 Positive resist system having high resistance to oxygen reactive ion etching Krishna G. Sachdev, Ranee W. Kwong, Mahmoud Khojasteh 1987-05-12
4599243 Use of plasma polymerized organosilicon films in fabrication of lift-off masks Krishna G. Sachdev 1986-07-08
4562091 Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks Krishna G. Sachdev 1985-12-31
4525722 Chemical heat amplification in thermal transfer printing Krishna G. Sachdev, Ari Aviram, Mark A. Wizner 1985-06-25
4519872 Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes Herbert R. Anderson, Jr., Krishna G. Sachdev 1985-05-28