Issued Patents All Time
Showing 25 most recent of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2018-08-14 |
| 9991157 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2018-06-05 |
| 9390970 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2016-07-12 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-04-15 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-03-11 |
| 8158511 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2012-04-17 |
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2011-08-02 |
| 7795138 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2010-09-14 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2010-03-30 |
| 7589016 | Method of depositing a sculptured copper seed layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2009-09-15 |
| 7547644 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2009-06-16 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2008-06-03 |
| 7335282 | Sputtering using an unbalanced magnetron | Jianming Fu, Praburam Gopalraja, John C. Forster | 2008-02-26 |
| 7294574 | Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement | Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Michael Miller, Jianming Fu +2 more | 2007-11-13 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 7112528 | Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug | Liang-Yuh Chen, Ted Guo, Roderick Craig Mosley | 2006-09-26 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2006-07-11 |
| 7026238 | Reliability barrier integration for Cu application | Ming Xi, Paul Smith, Ling Chen, Michael Yang, Mei Chang +2 more | 2006-04-11 |
| 6991709 | Multi-step magnetron sputtering process | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2006-01-31 |
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2005-12-13 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition | Bo Zheng, Hougong Wang, Girish Dixit | 2005-07-05 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Jick Yu | 2005-05-31 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Jick Yu | 2005-04-26 |
| 6797620 | Method and apparatus for improved electroplating fill of an aperture | John Lewis, Srinivas Gandikota, Sivakami Ramanathan, Girish Dixit, Robin Cheung | 2004-09-28 |