Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461014 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Ram Viswanath, Paul R. Start, Rajen S. Sidhu | 2016-10-04 |
| 9265170 | Integrated circuit connectors | Ram Viswanath, Sanka Ganesan, Gaurav Chawla, Joshua D. Heppner, Jeffory L. Smalley +4 more | 2016-02-16 |
| 9118151 | Interconnect cable with edge finger connector | Donald T. Tran | 2015-08-25 |
| 9064971 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Ram Viswanath, Paul R. Start, Rajen S. Sidhu | 2015-06-23 |
| 9010618 | Magnetic attachment structure | Aleksandar Aleksov, Ting Zhong | 2015-04-21 |
| 9006887 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Leonel Arana, Yoshihiro Tomita, Yosuke Kanaoka | 2015-04-14 |
| 8939347 | Magnetic intermetallic compound interconnect | Ravindranath V. Mahajan | 2015-01-27 |
| 8915747 | Connector assembly with integrated pitch translation | Gaurav Chawla, Donald T. Tran | 2014-12-23 |
| 8609532 | Magnetically sintered conductive via | Ravindranath V. Mahajan | 2013-12-17 |
| 8569108 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rahul N. Manepalli | 2013-10-29 |
| 8550327 | Clad solder thermal interface material | Carl Deppisch | 2013-10-08 |
| 8513792 | Package-on-package interconnect stiffener | Sanka Ganesan, Yosuke Kanaoka, Ram Viswanath, Robert M. Nickerson, Leonel Arana +2 more | 2013-08-20 |
| 8434668 | Magnetic attachment structure | Aleksandar Aleksov, Ting Zhong | 2013-05-07 |
| 8377550 | Flip chip package containing novel underfill materials | Hong Dong, Sandeep Razdan, Nisha Ananthakrisnan, Rahul N. Manepalli | 2013-02-19 |
| 8313958 | Magnetic microelectronic device attachment | Ravindranath V. Mahajan, John S. Guzek | 2012-11-20 |
| 8287996 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rahul N. Manepalli | 2012-10-16 |
| 8222730 | Magnetic particle-based composite materials for semiconductor packages | — | 2012-07-17 |
| 7906376 | Magnetic particle-based composite materials for semiconductor packages | — | 2011-03-15 |
| 7902060 | Attachment using magnetic particle based solder composites | — | 2011-03-08 |