Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9099461 | Method of manufacturing scaled equivalent oxide thickness gate stacks in semiconductor devices and related design structure | Michael P. Chudzik, Min Dai, Jinping Liu, Paul A. Ronsheim, Joseph F. Shepard, Jr. | 2015-08-04 |
| 9087722 | Semiconductor devices having different gate oxide thicknesses | Charlotte DeWan Adams, Michael P. Chudzik, Siddarth A. Krishnan, Unoh Kwon | 2015-07-21 |
| 9087784 | Structure and method of Tinv scaling for high k metal gate technology | Michael P. Chudzik, Dechao Guo, Siddarth A. Krishnan, Unoh Kwon, Carl Radens | 2015-07-21 |
| 9040369 | Structure and method for replacement gate MOSFET with self-aligned contact using sacrificial mandrel dielectric | Michael P. Chudzik, Carl Radens | 2015-05-26 |
| 9029959 | Composite high-k gate dielectric stack for reducing gate leakage | MaryJane Brodsky, Michael P. Chudzik, Min Dai, Joseph F. Shepard, Jr., Yanfeng Wang +1 more | 2015-05-12 |
| 9006837 | Structure and method of Tinv scaling for high k metal gate technology | Michael P. Chudzik, Dechao Guo, Siddarth A. Krishnan, Unoh Kwon, Carl Radens | 2015-04-14 |
| 9006064 | Multi-plasma nitridation process for a gate dielectric | Michael P. Chudzik, Barry P. Linder | 2015-04-14 |
| 8952460 | Germanium oxide free atomic layer deposition of silicon oxide and high-k gate dielectric on germanium containing channel for CMOS devices | MaryJane Brodsky, Murshed Chowdhury, Michael P. Chudzik, Min Dai, Siddarth A. Krishnan +1 more | 2015-02-10 |
| 8941177 | Semiconductor devices having different gate oxide thicknesses | Charlotte DeWan Adams, Michael P. Chudzik, Siddarth A. Krishnan, Unoh Kwon | 2015-01-27 |
| 8836037 | Structure and method to form input/output devices | Takashi Ando, Min Dai, Martin M. Frank, Barry P. Linder | 2014-09-16 |
| 8809152 | Germanium oxide free atomic layer deposition of silicon oxide and high-k gate dielectric on germanium containing channel for CMOS devices | MaryJane Brodsky, Murshed Chowdhury, Michael P. Chudzik, Min Dai, Siddarth A. Krishnan +1 more | 2014-08-19 |
| 8643115 | Structure and method of Tinv scaling for high κ metal gate technology | Michael P. Chudzik, Dechao Guo, Siddarth A. Krishnan, Unoh Kwon, Carl Radens | 2014-02-04 |
| 8492290 | Fabrication of silicon oxide and oxynitride having sub-nanometer thickness | Michael P. Chudzik, Min Dai, Joseph F. Shepard, Jr., Jinping Liu | 2013-07-23 |
| 8431476 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Steven J. Koester, Christopher C. Parks +1 more | 2013-04-30 |
| 8421077 | Replacement gate MOSFET with self-aligned diffusion contact | Sameer H. Jain, Carl Radens, Jay William Strane | 2013-04-16 |
| 8415772 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Steven J. Koester, Christopher C. Parks +1 more | 2013-04-09 |
| 8373239 | Structure and method for replacement gate MOSFET with self-aligned contact using sacrificial mandrel dielectric | Michael P. Chudzik, Carl Radens | 2013-02-12 |
| 8349729 | Hybrid bonding interface for 3-dimensional chip integration | Karl W. Barth, Ricardo A. Donaton, Spyridon Galis, Kevin S. Petrarca | 2013-01-08 |
| 8273649 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Steven J. Koester, Christopher C. Parks +1 more | 2012-09-25 |
| 8159060 | Hybrid bonding interface for 3-dimensional chip integration | Karl W. Barth, Ricardo A. Donaton, Spyridon Galis, Kevin S. Petrarca | 2012-04-17 |
| 7977032 | Method to create region specific exposure in a layer | Christos D. Dimitrakopoulos, Daniel C. Edelstein, Vincent J. McGahay, Satyanarayana V. Nitta, Kevin S. Petrarca +1 more | 2011-07-12 |
| 7851919 | Metal interconnect and IC chip including metal interconnect | Karl W. Barth, Ramona Kei, Kaushik A. Kumar, Kevin S. Petrarca | 2010-12-14 |
| 7718525 | Metal interconnect forming methods and IC chip including metal interconnect | Karl W. Barth, Ramona Kei, Kaushik A. Kumar, Kevin S. Petrarca | 2010-05-18 |
| 7645694 | Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent | Matthew E. Colburn, Dmitriy Shneyder | 2010-01-12 |
| 7531444 | Method to create air gaps using non-plasma processes to damage ILD materials | Christos D. Dimitrakopoulos, Daniel C. Edelstein, Vincent J. McGahay, Satyanarayana V. Nittta, Kevin S. Petrarca +1 more | 2009-05-12 |