Issued Patents All Time
Showing 26–50 of 117 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103068 | Detecting a void between a via and a wiring line | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2018-10-16 |
| 10049974 | Metal silicate spacers for fully aligned vias | Benjamin D. Briggs, Jessica Dechene, Joe Lee | 2018-08-14 |
| 10002831 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2018-06-19 |
| 9960117 | Air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Dimitri Kioussis, Christopher J. Penny, Deepika Priyadarshini | 2018-05-01 |
| 9911690 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Satyanarayana V. Nitta, David L. Rath | 2018-03-06 |
| 9905513 | Selective blocking boundary placement for circuit locations requiring electromigration short-length | Benjamin D. Briggs, Joe Lee, Christopher J. Penny | 2018-02-27 |
| 9881833 | Barrier planarization for interconnect metallization | Benjamin D. Briggs, Takeshi Nogami, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath | 2018-01-30 |
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2017-12-26 |
| 9806023 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2017-10-31 |
| 9793193 | Air gap and air spacer pinch off | Griselda Bonilla, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini | 2017-10-17 |
| 9786760 | Air gap and air spacer pinch off | Griselda Bonilla, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini | 2017-10-10 |
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin | 2017-09-12 |
| 9711455 | Method of forming an air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Dimitri Kioussis, Christopher J. Penny, Deepika Priyadarshini | 2017-07-18 |
| 9685406 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2017-06-20 |
| 9666529 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Takeshi Nogami, Raghuveer R. Patlolla, Christopher J. Penny, Theodorus E. Standaert | 2017-05-30 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2017-03-21 |
| 9502350 | Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-11-22 |
| 9472477 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin | 2016-10-18 |
| 9431292 | Alternate dual damascene method for forming interconnects | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2016-08-30 |
| 9379057 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Takeshi Nogami, Raghuveer R. Patlolla, Christopher J. Penny, Theodorus E. Standaert | 2016-06-28 |
| 9349687 | Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect | Stephen M. Gates, Joe Lee, Son V. Nguyen, Brown C. Peethala, Christopher J. Penny +1 more | 2016-05-24 |
| 9332628 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more | 2016-05-03 |
| 9324650 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Satyanarayana V. Nitta, David L. Rath | 2016-04-26 |
| 9305836 | Air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Dimitri Kioussis, Christopher J. Penny, Deepika Priyadarshini | 2016-04-05 |
| 9202863 | Structure with self aligned resist layer on an interconnect surface and method of making same | Daniel C. Edelstein, Robert D. Miller | 2015-12-01 |