CP

Christopher J. Penny

IBM: 150 patents #285 of 70,183Top 1%
TE Tessera: 11 patents #38 of 271Top 15%
AS Adeia Semiconductor Solutions: 2 patents #9 of 57Top 20%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Saratoga Springs, NY: #3 of 363 inventorsTop 1%
🗺 New York: #212 of 115,490 inventorsTop 1%
Overall (All Time): #5,065 of 4,157,543Top 1%
165
Patents All Time

Issued Patents All Time

Showing 51–75 of 165 patents

Patent #TitleCo-InventorsDate
11164777 Top via with damascene line and via Lawrence A. Clevenger, Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison 2021-11-02
11164377 Motion-controlled portals in virtual reality Aldis Sipolins, Lawrence A. Clevenger, Benjamin D. Briggs, Michael Rizzolo, Patrick Watson 2021-11-02
11158537 Top vias with subtractive line formation Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison 2021-10-26
11152299 Hybrid selective dielectric deposition for aligned via integration Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger, Robert R. Robison 2021-10-19
11152257 Barrier-less prefilled via formation Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Robert R. Robison +1 more 2021-10-19
11139201 Top via with hybrid metallization Koichi Motoyama, Nicholas Anthony Lanzillo, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger 2021-10-05
11138890 Secure access for drone package delivery Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins 2021-10-05
11113533 Smart display apparatus and control system Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz, Jean Wynne, Jonathan Fry 2021-09-07
11062943 Top via interconnects with wrap around liner Koichi Motoyama, Nicholas Anthony Lanzillo, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger 2021-07-13
11056429 Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2021-07-06
11018007 Self aligned pattern formation post spacer etchback in tight pitch configurations Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +2 more 2021-05-25
11005646 Blockchain stochastic timer transaction synchronization Jonathan Fry, James J. Demarest, Marc A. Bergendahl, Jean Wynne, Christopher J. Waskiewicz 2021-05-11
11004790 Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo 2021-05-11
10978393 Hybrid dielectric scheme for varying liner thickness and manganese concentration Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Michael Rizzolo 2021-04-13
10978343 Interconnect structure having fully aligned vias Chanro Park, Nicholas Anthony Lanzillo, Lawrence A. Clevenger, Balasubramanian Pranatharthiharan 2021-04-13
10971030 Remote physical training Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins 2021-04-06
10964588 Selective ILD deposition for fully aligned via with airgap Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha 2021-03-30
10957583 Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more 2021-03-23
10943866 Method and structure to construct cylindrical interconnects to reduce resistance Benjamin D. Briggs, Michael Rizzolo, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha 2021-03-09
10916154 Language learning and speech enhancement through natural language processing Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Krishna R. Tunga +1 more 2021-02-09
10833149 Capacitors Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert, Junli Wang 2020-11-10
10784156 Self-aligned airgaps with conductive lines and vias Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2020-09-22
10784197 Method and structure to construct cylindrical interconnects to reduce resistance Benjamin D. Briggs, Michael Rizzolo, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha 2020-09-22
10785590 Binaural audio calibration Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins 2020-09-22
10770653 Selective dielectric deposition to prevent gouging in MRAM Marc A. Bergendahl, Michael Rizzolo, Christopher J. Waskiewicz 2020-09-08