| 11430735 |
Barrier removal for conductor in top via integration scheme |
Brent A. Anderson, Nicholas Anthony Lanzillo, Lawrence A. Clevenger, Kisik Choi, Robert R. Robison |
2022-08-30 |
| 11373880 |
Creating different width lines and spaces in a metal layer |
Ekmini Anuja De Silva, Ashim Dutta, Abraham Arceo de la Pena |
2022-06-28 |
| 11351811 |
Optically-passive magnetic signature and identification feature with electromagnetic tamper detection |
Michael Rizzolo, Marc A. Bergendahl, Christopher J. Waskiewicz |
2022-06-07 |
| 11348872 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Michael Rizzolo |
2022-05-31 |
| 11348060 |
Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather |
Benjamin D. Briggs, Leigh Anne H. Clevenger, Aldis Sipolins, Michael Rizzolo, Lawrence A. Clevenger |
2022-05-31 |
| 11315827 |
Skip via connection between metallization levels |
Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha, Nicholas Anthony Lanzillo |
2022-04-26 |
| 11302575 |
Subtractive line with damascene second line type |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2022-04-12 |
| 11302205 |
Language learning and speech enhancement through natural language processing |
Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Krishna R. Tunga +1 more |
2022-04-12 |
| 11295978 |
Interconnects having spacers for improved top via critical dimension and overlay tolerance |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2022-04-05 |
| 11289371 |
Top vias with selectively retained etch stops |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2022-03-29 |
| 11276639 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-03-15 |
| 11276611 |
Top via on subtractively etched conductive line |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-03-15 |
| 11263068 |
Proximity correction in three-dimensional manufacturing |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2022-03-01 |
| 11263059 |
Load leveler |
Jonathan Fry, Marc A. Bergendahl, Christopher J. Waskiewicz, Jean Wynne, James J. Demarest |
2022-03-01 |
| 11244859 |
Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line |
Koichi Motoyama, Cornelius Brown Peethala, Nicholas Anthony Lanzillo, Lawrence A. Clevenger |
2022-02-08 |
| 11232977 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2022-01-25 |
| 11227793 |
Self-aligned pattern formation for a semiconductor device |
Sean D. Burns, Lawrence A. Clevenger, Nelson Felix, Sivananda K. Kanakasabapathy, Nicole Saulnier |
2022-01-18 |
| 11217481 |
Fully aligned top vias |
Nicholas Anthony Lanzillo, Koichi Motoyama, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger |
2022-01-04 |
| 11210968 |
Behavior-based interactive educational sessions |
Lawrence A. Clevenger, Stefania Axo, Leigh Anne H. Clevenger, Krishna R. Tunga, Mahmoud Amin +4 more |
2021-12-28 |
| 11195792 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2021-12-07 |
| 11195795 |
Well-controlled edge-to-edge spacing between adjacent interconnects |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-12-07 |
| 11189568 |
Top via interconnect having a line with a reduced bottom dimension |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-11-30 |
| 11177166 |
Etch stop layer removal for capacitance reduction in damascene top via integration |
Brent A. Anderson, Lawrence A. Clevenger, Robert R. Robison, Kisik Choi, Nicholas Anthony Lanzillo |
2021-11-16 |
| 11177162 |
Trapezoidal interconnect at tight BEOL pitch |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang, Junli Wang, Koichi Motoyama +1 more |
2021-11-16 |
| 11171084 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-11-09 |
