BL

Baozhen Li

IBM: 141 patents #321 of 70,183Top 1%
Globalfoundries: 15 patents #235 of 4,424Top 6%
ET Elpis Technologies: 2 patents #16 of 121Top 15%
SP Siemens Westinghouse Power: 1 patents #173 of 394Top 45%
📍 South Burlington, VT: #9 of 1,136 inventorsTop 1%
🗺 Vermont: #27 of 4,968 inventorsTop 1%
Overall (All Time): #5,398 of 4,157,543Top 1%
160
Patents All Time

Issued Patents All Time

Showing 51–75 of 160 patents

Patent #TitleCo-InventorsDate
10763210 Circular ring shaped antifuse device Chih-Chao Yang 2020-09-01
10741441 Collar formation for chamfer-less and chamfered vias Chih-Chao Yang, Andrew Tae Kim 2020-08-11
10699950 Method of optimizing wire RC for device performance and reliability Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II, Terry A. Spooner 2020-06-30
10651083 Graded interconnect cap Andrew Tae Kim, Ernest Y. Wu, Chih-Chao Yang 2020-05-12
10636738 Contacts having a geometry to reduce resistance Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang 2020-04-28
10615112 MIM capacitor for improved process defect tolerance Chih-Chao Yang, Andrew Tae Kim 2020-04-07
10539611 Integrated circuit chip reliability qualification using a sample-specific expected fail rate Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder 2020-01-21
10534888 Hybrid back end of line metallization to balance performance and reliability Chih-Chao Yang, Theo Standaert 2020-01-14
10490513 Advanced crack stop structure Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla 2019-11-26
10475753 Advanced crack stop structure Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla 2019-11-12
10468346 Advanced interconnects containing an IMT liner Joseph F. Maniscalco, Andrew Tae Kim, Chih-Chao Yang 2019-11-05
10468491 Low resistance contact for transistors Lawrence A. Clevenger, Junli Wang, Kirk D. Peterson, Terry A. Spooner, John E. Sheets, II 2019-11-05
10460990 Semiconductor via structure with lower electrical resistance Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang 2019-10-29
10460985 Enhancement of iso-via reliability Lawrence A. Clevenger, Xiao Hu Liu, Kirk D. Peterson 2019-10-29
10396042 Dielectric crack stop for advanced interconnects Chih-Chao Yang, Griselda Bonilla 2019-08-27
10361265 Precision BEOL resistors Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang 2019-07-23
10340330 Precision BEOL resistors Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang 2019-07-02
10332956 Precision beol resistors Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang 2019-06-25
10332955 Precision BEOL resistors Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang 2019-06-25
10262934 Three plate MIM capacitor via integrity verification Andrew Tae Kim, Barry P. Linder, Ernest Y. Wu 2019-04-16
10256145 Semiconductor device and method of forming the semiconductor device Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang 2019-04-09
10229873 Three plate MIM capacitor via integrity verification Andrew Tae Kim, Barry P. Linder, Ernest Y. Wu 2019-03-12
10216870 Methodology to prevent metal lines from current pulse damage Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder 2019-02-26
10103060 Test structures for dielectric reliability evaluations David G. Brochu, JR., Roger A. Dufresne, Barry P. Linder, James H. Stathis, Ernest Y. Wu 2018-10-16
10090240 Interconnect structure with capacitor element and related methods Chih-Chao Yang, Keith Kwong Hon Wong 2018-10-02