Issued Patents All Time
Showing 26–50 of 160 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152300 | Electrical fuse with metal line migration | Yan Li, Keith Kwong Hon Wong, Chih-Chao Yang | 2021-10-19 |
| 11145591 | Integrated circuit (IC) device integral capacitor and anti-fuse | Jim Shih-Chun Liang, Chih-Chao Yang | 2021-10-12 |
| 11145543 | Semiconductor via structure with lower electrical resistance | Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang | 2021-10-12 |
| 11133462 | Bottom electrode structure and method of forming the same | Chih-Chao Yang, Andrew Tae Kim | 2021-09-28 |
| 11121082 | Sub-ground rule e-Fuse structure | Andrew Tae Kim, Chih-Chao Yang, Ernest Y. Wu | 2021-09-14 |
| 11101213 | EFuse structure with multiple links | Chih-Chao Yang, Jim Shih-Chun Liang, Tian Shen | 2021-08-24 |
| 11099230 | Electromigration test structures for void localization | Chih-Chao Yang | 2021-08-24 |
| 11062993 | Contacts having a geometry to reduce resistance | Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang | 2021-07-13 |
| 11031457 | Low resistance high capacitance density MIM capacitor | Chih-Chao Yang | 2021-06-08 |
| 10998263 | Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device | Jim Shih-Chun Liang, Naftali E. Lustig, Ning Lu | 2021-05-04 |
| 10971447 | BEOL electrical fuse | Chih-Chao Yang, Andrew Tae Kim | 2021-04-06 |
| 10964647 | Dielectric crack stop for advanced interconnects | Chih-Chao Yang, Griselda Bonilla | 2021-03-30 |
| 10957657 | Advanced crack stop structure | Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla | 2021-03-23 |
| 10943972 | Precision BEOL resistors | Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang | 2021-03-09 |
| 10930589 | Advanced interconnects containing an IMT liner | Joseph F. Maniscalco, Andrew Tae Kim, Chih-Chao Yang | 2021-02-23 |
| 10923575 | Low resistance contact for transistors | Lawrence A. Clevenger, Junli Wang, Kirk D. Peterson, Terry A. Spooner, John E. Sheets, II | 2021-02-16 |
| 10903117 | Fabricating vias with lower resistance | Chih-Chao Yang, Andrew Tae Kim | 2021-01-26 |
| 10847458 | BEOL electrical fuse and method of forming the same | Chih-Chao Yang | 2020-11-24 |
| 10847475 | Advanced crack stop structure | Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla | 2020-11-24 |
| 10840194 | Advanced crack stop structure | Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla | 2020-11-17 |
| 10840195 | Advanced crack stop structure | Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla | 2020-11-17 |
| 10840447 | Fabrication of phase change memory cell in integrated circuit | Chih-Chao Yang, Andrew Tae Kim, Barry P. Linder | 2020-11-17 |
| 10811353 | Sub-ground rule e-Fuse structure | Chih-Chao Yang, Andrew Tae Kim, Ernest Y. Wu | 2020-10-20 |
| 10784159 | Semiconductor device and method of forming the semiconductor device | Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2020-09-22 |
| 10770393 | BEOL thin film resistor | Andrew Tae Kim, Ernest Y. Wu, Chih-Chao Yang | 2020-09-08 |