Issued Patents All Time
Showing 326–350 of 633 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8673670 | Micro-electro-mechanical system (MEMS) structures and design structures | Brian M. Czabaj, David A. DeMuynck | 2014-03-18 |
| 8649153 | Tapered via and MIM capacitor | James S. Dunn, Zhong-Xiang He | 2014-02-11 |
| 8643190 | Through substrate via including variable sidewall profile | Edward C. Cooney, III, Peter J. Lindgren, Doreen Jane Ossenkop | 2014-02-04 |
| 8645898 | Structure and design structure for high-Q value inductor and method of manufacturing the same | Hanyi Ding, Mete Erturk, Robert A. Groves, Zhong-Xiang He, Peter J. Lindgren | 2014-02-04 |
| 8635765 | Method of forming micro-electrical-mechanical structure (MEMS) | Dawn D. Hall, Mark C. H. Lamorey | 2014-01-28 |
| 8631570 | Through wafer vias with dishing correction methods | Peter J. Lindgren, Edmund J. Sprogis | 2014-01-21 |
| 8633106 | Heterojunction bipolar transistors and methods of manufacture | James S. Dunn, Alvin J. Joseph | 2014-01-21 |
| 8629036 | Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure | Stephen E. Luce | 2014-01-14 |
| 8609505 | Method of forming MIM capacitor structure in FEOL | Douglas D. Coolbaugh, Ebenezer E. Eshun, Robert M. Rassel | 2013-12-17 |
| 8604898 | Vertical integrated circuit switches, design structure and methods of fabricating same | Felix P. Anderson, Edward C. Cooney, III, Thomas L. McDevitt | 2013-12-10 |
| 8603889 | Integrated circuit structure having air-gap trench isolation and related design structure | Renata Camillo-Castillo, James S. Dunn, David L. Harame | 2013-12-10 |
| 8592876 | Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures | Hanyi Ding, Qizhi Liu | 2013-11-26 |
| 8569888 | Wiring structure and method of forming the structure | Fen Chen, Jeffrey P. Gambino, Timothy D. Sullivan | 2013-10-29 |
| 8569091 | Integrated circuit switches, design structure and methods of fabricating the same | Felix P. Anderson, Thomas L. McDevitt | 2013-10-29 |
| 8564113 | Electrostatic chucking of an insulator handle substrate | Paul S. Andry, Edward C. Cooney, III, Edmund J. Sprogis, Cornelia K. Tsang | 2013-10-22 |
| 8563336 | Method for forming thin film resistor and terminal bond pad simultaneously | Fen Chen, Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee, John C. Malinowski | 2013-10-22 |
| 8546240 | Methods of manufacturing integrated semiconductor devices with single crystalline beam | David L. Harame, Stephen E. Luce | 2013-10-01 |
| 8535966 | Horizontal coplanar switches and methods of manufacture | Felix P. Anderson, Thomas L. McDevitt | 2013-09-17 |
| 8528397 | Hermeticity sensor and related method | — | 2013-09-10 |
| 8530970 | Curvilinear wiring structure to reduce areas of high field density in an integrated circuit | Felix P. Anderson, Thomas L. McDevitt | 2013-09-10 |
| 8518787 | Through wafer vias and method of making same | Hanyi Ding, Alvin J. Joseph | 2013-08-27 |
| 8518817 | Method of electrolytic plating and semiconductor device fabrication | Felix P. Anderson, Zhong-Xiang He, Eric J. White | 2013-08-27 |
| 8513769 | Electrical fuses and resistors having sublithographic dimensions | Charles T. Black, Matthew E. Colburn, Timothy J. Dalton, Daniel C. Edelstein, Wai-Kin Li +1 more | 2013-08-20 |
| 8497203 | Semiconductor structures and methods of manufacture | Fen Chen, Zhong-Xiang He | 2013-07-30 |
| 8492816 | Deep trench decoupling capacitor | James S. Nakos, Edmund J. Sprogis | 2013-07-23 |