Issued Patents All Time
Showing 76–100 of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429109 | Method to form high k dielectric and silicide to reduce poly depletion by using a sacrificial metal between oxide and gate | Jia Zhen Zheng, Elgin Quek, Daniel Yen, Chew Hoe Ang, Eng Hua Lim +1 more | 2002-08-06 |
| 6424044 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Xu Yi, Joseph Xie, Simon Chooi | 2002-07-23 |
| 6419754 | Endpoint detection and novel chemicals in copper stripping | Simon Chooi | 2002-07-16 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6394114 | Method for stripping copper in damascene interconnects | Subhash Gupta, Simon Chooi, Paul Ho | 2002-05-28 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-05-21 |
| 6387765 | Method for forming an extended metal gate using a damascene process | Vijai Kumar Chhagan, Yelehanka Ramachandramurthy Pradeep, Henry Gerung, Simon Chooi | 2002-05-14 |
| 6383922 | Thermal stability improvement of CoSi2 film by stuffing in titanium | Bei Chao Zhang, Chung Woh Lai, Eng Hua Lim, Peter Chew, Arthur Ang | 2002-05-07 |
| 6380087 | CMP process utilizing dummy plugs in damascene process | Subhash Gupta, Ramasamy Chockalingam | 2002-04-30 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, John Sudijono +2 more | 2002-04-30 |
| 6376353 | Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects | Sangki Hong, Simon Chooi | 2002-04-23 |
| 6376361 | Method to remove excess metal in the formation of damascene and dual interconnects | Simon Chooi, Tak Yan Tse | 2002-04-23 |
| 6372636 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Subhash Gupta, Sangki Hong | 2002-04-16 |
| 6368958 | Method to deposit a cooper seed layer for dual damascence interconnects | Paul Ho, Subhash Gupta, Simon Chooi | 2002-04-09 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-03-19 |
| 6358842 | Method to form damascene interconnects with sidewall passivation to protect organic dielectrics | Simon Chooi, Yi Xu | 2002-03-19 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Subhash Gupta, Simon Chooi, Sangki Hong | 2002-03-05 |
| 6352921 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Yi Xu, Joseph Xie, Simon Chooi | 2002-03-05 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Simon Chooi, Subhash Gupta, Yi Xu | 2002-02-26 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta +2 more | 2002-02-26 |
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Subhash Gupta, Yi Xu, Simon Chooi | 2002-02-19 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-01-22 |
| 6331479 | Method to prevent degradation of low dielectric constant material in copper damascene interconnects | Jianxun Li, Yi Xu, Simon Chooi | 2001-12-18 |