Issued Patents All Time
Showing 101–125 of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6309982 | Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent | Simon Chooi, Yi Xu, Yakub Aliyu, John Sudijono, Subhash Gupta +2 more | 2001-10-30 |
| 6303447 | Method for forming an extended metal gate using a damascene process | Vijai Chhagan, Yelehanka Ramachandramurthy Pradeep, Henry Gerung, Simon Chooi | 2001-10-16 |
| 6287979 | Method for forming an air gap as low dielectric constant material using buckminsterfullerene as a porogen in an air bridge or a sacrificial layer | Simon Chooi | 2001-09-11 |
| 6284606 | Process to achieve uniform groove depth in a silicon substrate | Ganesh Samudra, Krishnasamy Rajendran, Chi-Kwan Lau | 2001-09-04 |
| 6284637 | Method to fabricate a floating gate with a sloping sidewall for a flash memory | Vijai Chhagan, Yelehanka Machandramurthy Pradee, Henry Gerung | 2001-09-04 |
| 6284657 | Non-metallic barrier formation for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Sangki Hong | 2001-09-04 |
| 6274499 | Method to avoid copper contamination during copper etching and CMP | Subhash Gupta, Paul Ho, Ramasamy Chockalingam | 2001-08-14 |
| 6271115 | Post metal etch photoresist strip method | Wen-Jun Liu, Simon Chooi, Raymond Joy | 2001-08-07 |
| 6265321 | Air bridge process for forming air gaps | Simon Chooi, Yi Xu | 2001-07-24 |
| 6261942 | Dual metal-oxide layer as air bridge | Simon Chooi, Xu Yi | 2001-07-17 |
| 6261955 | Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes | Yakub Aliyu, Simon Chooi, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2001-07-17 |
| 6261954 | Method to deposit a copper layer | Paul Ho, Subhash Gupta, Simon Chooi | 2001-07-17 |
| 6255266 | Alkyldione peroxides as cleaning solutions for wafer fabs | Subhash Gupta, Simon I, Paul Ho | 2001-07-03 |
| 6251781 | Method to deposit a platinum seed layer for use in selective copper plating | Guo Qin Xu, Lap Chan | 2001-06-26 |
| 6251786 | Method to create a copper dual damascene structure with less dishing and erosion | Paul Ho, Subhash Gupta | 2001-06-26 |
| 6228713 | Self-aligned floating gate for memory application using shallow trench isolation | Yelehanka Ramachandramurthy Pradeep, Vijay Kumar Chhagan, Jie Yu | 2001-05-08 |
| 6225202 | Selective etching of unreacted nickel after salicidation | Subhash Gupta, Simon Chooi, Sangki Hong | 2001-05-01 |
| 6225221 | Method to deposit a copper seed layer for dual damascene interconnects | Paul Ho, Subhash Gupta, Chockalingam Ramasamy | 2001-05-01 |
| 6184138 | Method to create a controllable and reproducible dual copper damascene structure | Paul Ho, Subhash Gupta | 2001-02-06 |
| 6165891 | Damascene structure with reduced capacitance using a carbon nitride, boron nitride, or boron carbon nitride passivation layer, etch stop layer, and/or cap layer | Simon Chooi, Yi Xu | 2000-12-26 |
| 6156598 | Method for forming a lightly doped source and drain structure using an L-shaped spacer | Yelehanka Ramachandramurthy Pradeep, Jie Yu, Ying-Keung Leung | 2000-12-05 |
| 6140206 | Method to form shallow trench isolation structures | Jian Xun Li, Qing Hua Zhong | 2000-10-31 |
| 6132521 | Cleaning metal surfaces with alkyldione peroxides | Subhash Gupta, Simon Chooi, Paul Ho | 2000-10-17 |
| 6121130 | Laser curing of spin-on dielectric thin films | Chee Tee Chua, Yuan-Ping Lee, Lap Chan | 2000-09-19 |
| 6117777 | Chemical mechanical polish (CMP) endpoint detection by colorimetry | Simon Chooi | 2000-09-12 |