Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6251781 | Method to deposit a platinum seed layer for use in selective copper plating | Mei Sheng Zhou, Lap Chan | 2001-06-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6251781 | Method to deposit a platinum seed layer for use in selective copper plating | Mei Sheng Zhou, Lap Chan | 2001-06-26 |