Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6284606 | Process to achieve uniform groove depth in a silicon substrate | Ganesh Samudra, Krishnasamy Rajendran, Mei Sheng Zhou | 2001-09-04 |
| 5476800 | Method for formation of a buried layer for a semiconductor device | Gregory N. Burton, Chen-Hsi Lin | 1995-12-19 |
| 5158900 | Method of separately fabricating a base/emitter structure of a BiCMOS device | Donald L. Packwood, Chen-Hsi Lin, Ashor Kapoor | 1992-10-27 |
| 4587718 | Process for forming TiSi.sub.2 layers of differing thicknesses in a single integrated circuit | Roger A. Haken, Michael E. Alperin | 1986-05-13 |
| 4545116 | Method of forming a titanium disilicide | — | 1985-10-08 |