Issued Patents All Time
Showing 126–144 of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6114243 | Method to avoid copper contamination on the sidewall of a via or a dual damascene structure | Subhash Gupta, Kwok Keung Paul Ho, Simon Yew-Meng Chool | 2000-09-05 |
| 6063547 | Physical vapor deposition poly-p-phenylene sulfide film as a bottom anti-reflective coating on polysilicon | Jianhui Ye | 2000-05-16 |
| 6057240 | Aqueous surfactant solution method for stripping metal plasma etch deposited oxidized metal impregnated polymer residue layers from patterned metal layers | Jian Ye, Simon Chooi, Young-Tong Tsai | 2000-05-02 |
| 6040243 | Method to form copper damascene interconnects using a reverse barrier metal scheme to eliminate copper diffusion | Jianxun Li, Simon Chooi | 2000-03-21 |
| 6017826 | Chlorine containing plasma etch method with enhanced sidewall passivation and attenuated microloading effect | Paul Ho, Thomas Schuelke | 2000-01-25 |
| 6009888 | Photoresist and polymer removal by UV laser aqueous oxidant | Jian Ye, Yuan-Ping Lee, Yong Lu | 2000-01-04 |
| 5989979 | Method for controlling the silicon nitride profile during patterning using a novel plasma etch process | Wen-Jun Liu, Pei Ching Lee | 1999-11-23 |
| 5948701 | Self-aligned contact (SAC) etching using polymer-building chemistry | Simon Chooi, Jian Xun Li | 1999-09-07 |
| 5930627 | Process improvements in self-aligned polysilicon MOSFET technology using silicon oxynitride | Sheau-Tan Loong, Koon Lay Denise Tan, Jian Xun Li, Wing Hong Chiu, Kok Hiang Tang | 1999-07-27 |
| 5866448 | Procedure for forming a lightly-doped-drain structure using polymer layer | Yelehanka Ramachandramurthy Pradeep, Tang Kok Hiang | 1999-02-02 |
| 5863307 | Method and slurry composition for chemical-mechanical polish (CMP) planarizing of copper containing conductor layers | Ron Fu Chu | 1999-01-26 |
| 5858847 | Method for a lightly doped drain structure | Yelehanka Ramachandramurthy Pradeep, Dajiang Xu | 1999-01-12 |
| 5801083 | Use of polymer spacers for the fabrication of shallow trench isolation regions with rounded top corners | Bo Yu, Qing Hua Zhong, Jian Ye | 1998-09-01 |
| 5801077 | Method of making sidewall polymer on polycide gate for LDD structure | Calvin Leung Yat Chor | 1998-09-01 |
| 5795699 | Langmuir-blodgett (LB) films as ARC and adhesion promoters for patterning of semiconductor devices | Ron Fu Chu | 1998-08-18 |
| 5792692 | Method of fabricating a twin hammer tree shaped capacitor structure for a dram device | Jian Xun Li, Simon Chooi | 1998-08-11 |
| 5792708 | Method for forming residue free patterned polysilicon layers upon high step height integrated circuit substrates | Lap Chan, Young-Tong Tsai | 1998-08-11 |
| 5780358 | Method for chemical-mechanical polish (CMP) planarizing of cooper containing conductor layers | Chu Ron-Fu | 1998-07-14 |
| 5747369 | Formation of a capacitor using a sacrificial etch stop | Arjun Kumar Kantimahanti, Chivukula Subrahmanyam | 1998-05-05 |