Issued Patents All Time
Showing 26–50 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495461 | Film stack for lithography applications | Tejinder Singh, Suketu Arun Parikh, Daniel Lee Diehl, Michael Stolfi, Jothilingam Ramalingam +3 more | 2022-11-08 |
| 11469096 | Method and chamber for backside physical vapor deposition | Chunming Zhou, Jothilingam Ramalingam, Kevin Moraes, Shane Lavan | 2022-10-11 |
| 11450514 | Methods of reducing particles in a physical vapor deposition (PVD) chamber | Wei Dou, Mingdong Li, Shane Lavan, Jothilingam Ramalingam, Chengyu Liu | 2022-09-20 |
| 11437559 | Method and apparatus for deposition of multilayer device with superconductive film | Mingwei Zhu, Zihao Yang, Nag B. Patibandla, Ludovic Godet, Daniel Lee Diehl +1 more | 2022-09-06 |
| 11393665 | Physical vapor deposition (PVD) chamber with reduced arcing | Chao Du, Chen Gong, Mingdong Li, Fuhong Zhang, Rongjun Wang +1 more | 2022-07-19 |
| 11353509 | Digital circuit robustness verification method and system | Wen Mao, Jin-Fu Huang, Dai-De Wei | 2022-06-07 |
| 11313034 | Methods for depositing amorphous silicon layers or silicon oxycarbide layers via physical vapor deposition | Weimin Zeng, Daniel Lee Diehl, Huixiong Dai, Khoi A. Phan, Christopher S. Ngai +2 more | 2022-04-26 |
| 11257677 | Methods and devices for subtractive self-alignment | He Ren, Hao Jiang, Mehul Naik, Wenting Hou, Jianxin Lei +1 more | 2022-02-22 |
| 11186676 | Polymer containing S,S-dioxide-dibenzothiophene in backbone chain with content-adjustable triarylamine end groups and preparation method and application thereof | Ting Guo, Feng Peng, Lei Ying, Wei YANG, Junbiao Peng | 2021-11-30 |
| D933176 | Vacuum toilet bowl | — | 2021-10-12 |
| 11056325 | Methods and apparatus for substrate edge uniformity | Thanh X. Nguyen, Alexander Jansen, Yana Cheng, Randal Dean Schmieding, Xianmin Tang +1 more | 2021-07-06 |
| 10991579 | Methods of making and using tin oxide film with smooth surface morphologies from sputtering target including tin and dopant | Weimin Zeng | 2021-04-27 |
| 10886155 | Optical stack deposition and on-board metrology | Mingwei Zhu, Zihao Yang, Nag B. Patibandla, Daniel Lee Diehl, Weimin Zeng +5 more | 2021-01-05 |
| 10886113 | Process kit and method for processing a substrate | Thanh X. Nguyen, Weimin Zeng | 2021-01-05 |
| 10835856 | Carbon molecular sieve adsorbent | Roger Dean Whitley, Shubhra Jyoti Bhadra, Erdem Arslan, Timothy Christopher Golden | 2020-11-17 |
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2020-07-07 |
| 10665426 | Methods for thin film material deposition using reactive plasma-free physical vapor deposition | Yana Cheng, Zhefeng Li, Chi Hong Ching, Rongjun Wang | 2020-05-26 |
| 10546742 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Mehul Naik, Yana Cheng, Weifeng YE | 2020-01-28 |
| 10353683 | Dynamically calculating and applying a timeout value to a manufacturer update service | Jianwen Yin, Xianghong Qian | 2019-07-16 |
| 10170299 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Mehul Naik, Yana Cheng, Weifeng YE | 2019-01-01 |
| 10116010 | Insulating mother board, insulating harness mother board assembly and battery module | Qixin Guo, Qiu Xie, Wei Li | 2018-10-30 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2018-10-23 |
| 10096725 | Method for graded anti-reflective coatings by physical vapor deposition | Daniel Lee Diehl, Rongjun Wang, Xianmin Tang, TAI-CHOU PAPO CHEN, Tingjun Xu | 2018-10-09 |
| 10090423 | Polymer containing 1,2,5-benzoselenadiazole-N-R1-5,6-dicarboxylic acid imide and preparation method and use thereof | Fei Huang, Xiaojuan MA, Peng Zhu | 2018-10-02 |
| 10008448 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Mehul Naik, Mei-Yee Shek | 2018-06-26 |