RB

Rajeev Bajaj

Applied Materials: 86 patents #56 of 7,310Top 1%
Motorola: 9 patents #1,091 of 12,470Top 9%
SE Semiquest: 7 patents #1 of 3Top 35%
NE Nexplanar: 3 patents #12 of 16Top 75%
Lam Research: 2 patents #1,015 of 2,128Top 50%
YS Yield Engineering Systems: 1 patents #14 of 29Top 50%
📍 San Jose, CA: #200 of 32,062 inventorsTop 1%
🗺 California: #1,791 of 386,348 inventorsTop 1%
Overall (All Time): #11,485 of 4,157,543Top 1%
112
Patents All Time

Issued Patents All Time

Showing 101–112 of 112 patents

Patent #TitleCo-InventorsDate
6261157 Selective damascene chemical mechanical polishing Fritz Redeker, John M. White, Shijian Li, Yutao Ma 2001-07-17
6254459 Wafer polishing device with movable window Herbert E. Litvak, Rahul Surana, Stephen Jew, Jiri Pecen 2001-07-03
6204169 Processing for polishing dissimilar conductive layers in a semiconductor device János Farkas, Sung-Cheol Kim, Jaime Saravia 2001-03-20
6071816 Method of chemical mechanical planarization using a water rinse to prevent particle contamination David Watts, Sanjit Das 2000-06-06
6068539 Wafer polishing device with movable window Herbert E. Litvak, Rahul Surana, Stephen Jew, Jiri Pecen 2000-05-30
6045435 Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects Subramoney Iyer, Thom Kobayashi, Jaime Saravia, Mark G. Fernandes, David Watts 2000-04-04
6001730 Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers János Farkas, Melissa Freeman, David Watts, Sanjit Das 1999-12-14
6001726 Method for using a conductive tungsten nitride etch stop layer to form conductive interconnects and tungsten nitride contact structure Rajan Nagabushnam, Ram Venkataraman, Shyam Mattay, Subramoney Iyer 1999-12-14
5916011 Process for polishing a semiconductor device substrate Sung-Cheol Kim, Mark A. Zaleski 1999-06-29
5899745 Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor Sung-Cheol Kim, Lei Ping Lai, Adam W. Manzonie 1999-05-04
5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture David Watts, Sanjit Das, János Farkas, Chelsea Dang, Melissa Freeman +3 more 1999-04-27
5882243 Method for polishing a semiconductor wafer using dynamic control Sanjit Das, Subramoney Iyer, Olubunmi O. Adetutu 1999-03-16