Issued Patents All Time
Showing 76–100 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7815778 | Electro-chemical mechanical planarization pad with uniform polish performance | — | 2010-10-19 |
| 7762871 | Pad conditioner design and method of use | — | 2010-07-27 |
| 7759165 | Nanospring | — | 2010-07-20 |
| 7530880 | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor | Natraj Narayanswami, Bang Nguyen | 2009-05-12 |
| 7153188 | Temperature control in a chemical mechanical polishing system | Steven M. Zuniga, Hung Chih Chen, Stan Tsai, Kapila Wijekoon, Fred C. Redeker | 2006-12-26 |
| 6960521 | Method and apparatus for polishing metal and dielectric substrates | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rahul Surana, Yongqi Hu +6 more | 2005-11-01 |
| 6911136 | Method for regulating the electrical power applied to a substrate during an immersion process | Bo Zheng, Zhonghui Wang | 2005-06-28 |
| 6872329 | Chemical mechanical polishing composition and process | Yuchun Wang, Fred C. Redeker, Shijian Li | 2005-03-29 |
| 6869332 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Fred C. Redeker | 2005-03-22 |
| 6790768 | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rahul Surana, Yongqi Hu +6 more | 2004-09-14 |
| 6783432 | Additives for pressure sensitive polishing compositions | Jui-Lung Li, Yuchun Wang, Fred C. Redeker | 2004-08-31 |
| 6638143 | Ion exchange materials for chemical mechanical polishing | Yuchun Wang, Stan Tsai, Kapila Wijekoon, Fred C. Redeker | 2003-10-28 |
| 6632124 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Savitha Nanjangud, Andreas Norbert Wiswesser, Stan Tsai +3 more | 2003-10-14 |
| 6629881 | Method and apparatus for controlling slurry delivery during polishing | Fred C. Redeker, Frank Bose, A. Jason Whitby | 2003-10-07 |
| 6620027 | Method and apparatus for hard pad polishing | Ajoy Zutshi, Fred C. Redeker, Yutao Ma, Kapila Wijekoon | 2003-09-16 |
| 6602724 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Fred C. Redeker | 2003-08-05 |
| 6585574 | Polishing pad with reduced moisture absorption | Brian Lombardo | 2003-07-01 |
| 6569349 | Additives to CMP slurry to polish dielectric films | Yuchun Wang, Fred C. Redeker | 2003-05-27 |
| 6561873 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Yuchun Wang, Kapila Wijekoon, Fred C. Redeker | 2003-05-13 |
| 6537144 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Yuchun Wang, Kapila Wijekoon, Fred C. Redeker | 2003-03-25 |
| 6520840 | CMP slurry for planarizing metals | Yuchun Wang, Fred C. Redeker | 2003-02-18 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Savitha Nanjangud, Andreas Norbert Wiswesser, Stan Tsai +3 more | 2003-01-14 |
| 6436302 | Post CU CMP polishing for reduced defects | Juy-Lung Li, Tse-Yong Yao, Fred C. Redeker, Yutao Ma | 2002-08-20 |
| 6435944 | CMP slurry for planarizing metals | Yuchun Wang, Fred C. Redeker | 2002-08-20 |
| 6436832 | Method to reduce polish initiation time in a polish process | Yutao Ma, Juilung Li, Fred C. Redeker, Tse-Yong Yao | 2002-08-20 |