JB

Jeong Soo Byun

Applied Materials: 33 patents #326 of 7,310Top 5%
Cypress Semiconductor: 13 patents #135 of 1,852Top 8%
LC Lg Semicon Co.: 12 patents #9 of 547Top 2%
OT On Semiconductoc Trading: 2 patents #8 of 91Top 9%
HE Hynix (Hyundai Electronics): 1 patents #731 of 1,604Top 50%
GC Goldstar Electron Co.: 1 patents #72 of 188Top 40%
LS Longitude Flash Memory Solutions: 1 patents #22 of 26Top 85%
📍 Cupertino, CA: #186 of 6,989 inventorsTop 3%
🗺 California: #5,163 of 386,348 inventorsTop 2%
Overall (All Time): #34,848 of 4,157,543Top 1%
64
Patents All Time

Issued Patents All Time

Showing 26–50 of 64 patents

Patent #TitleCo-InventorsDate
7605083 Formation of composite tungsten films Ken Kaung Lai, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos, Mei Chang +7 more 2009-10-20
7501343 Formation of boride barrier layers using chemisorption techniques Alfred Mak 2009-03-10
7501344 Formation of boride barrier layers using chemisorption techniques Alfred Mak 2009-03-10
7485556 Forming metal silicide on silicon-containing features of a substrate Jianxin Lei, Lisa Yang, Hien Minh Le 2009-02-03
7465666 Method for forming tungsten materials during vapor deposition processes Moris Kori, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ashok Sinha +1 more 2008-12-16
7405158 Methods for depositing tungsten layers employing atomic layer deposition techniques Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more 2008-07-29
7384867 Formation of composite tungsten films Ken Kaung Lai, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos, Mei Chang +7 more 2008-06-10
7294588 In-situ-etch-assisted HDP deposition M. Ziaul Karim, Dongqing Li, Thanh Pham 2007-11-13
7238552 Method and apparatus for depositing tungsten after surface treatment to improve film characteristics 2007-07-03
7235486 Method for forming tungsten materials during vapor deposition processes Moris Kori, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ashok Sinha +1 more 2007-06-26
7208413 Formation of boride barrier layers using chemisorption techniques Alfred Mak 2007-04-24
7115494 Method and system for controlling the presence of fluorine in refractory metal layers Ashok Sinha, Ming Xi, Moris Kori, Alfred Mak, Lawrence Chung-Lai Lei +1 more 2006-10-03
7085616 Atomic layer deposition apparatus Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung +1 more 2006-08-01
7049211 In-situ-etch-assisted HDP deposition using SiF4 M. Ziaul Karim, Dongqing Li, Thanh Pham 2006-05-23
7033922 Method and system for controlling the presence of fluorine in refractory metal layers Moris Kori, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ashok Sinha +1 more 2006-04-25
7033945 Gap filling with a composite layer Zheng Yuan, Shankar Venkataraman, M. Ziaul Karim, Thanh Pham, Ellie Yieh 2006-04-25
6939804 Formation of composite tungsten films Ken Kaung Lai, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos, Mei Chang +7 more 2005-09-06
6936538 Method and apparatus for depositing tungsten after surface treatment to improve film characteristics 2005-08-30
6903031 In-situ-etch-assisted HDP deposition using SiF4 and hydrogen M. Ziaul Karim, Dongqing Li, Thanh Pham 2005-06-07
6855368 Method and system for controlling the presence of fluorine in refractory metal layers Moris Kori, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung 2005-02-15
6849545 System and method to form a composite film stack utilizing sequential deposition techniques Alfred Mak, Mei Chang, Hua Chung, Ashok Sinha, Moris Kori 2005-02-01
6831004 Formation of boride barrier layers using chemisorption techniques Alfred Mak 2004-12-14
6620723 Formation of boride barrier layers using chemisorption techniques Alfred Mak 2003-09-16
6551929 Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques Moris Kori, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ashok Sinha +1 more 2003-04-22
6221762 Method for fabricating semiconductor device having improved step coverage and low resistivity contacts Byung-Hak Lee 2001-04-24