RS

Ramkumar Subramanian

AM AMD: 218 patents #6 of 9,279Top 1%
C3 Carefusion 303: 14 patents #36 of 459Top 8%
Caterpillar: 4 patents #1,659 of 8,398Top 20%
Lam Research: 4 patents #662 of 2,128Top 35%
Globalfoundries: 3 patents #1,029 of 4,424Top 25%
SL Spansion Llc.: 2 patents #309 of 769Top 45%
ST Sandisk Technologies: 2 patents #967 of 2,224Top 45%
WT Western Digital Technologies: 1 patents #1,787 of 3,180Top 60%
University Of Texas System: 1 patents #2,951 of 6,559Top 45%
MT Matheson Tri-Gas: 1 patents #28 of 47Top 60%
Microsoft: 1 patents #24,826 of 40,388Top 65%
📍 San Diego, CA: #88 of 23,606 inventorsTop 1%
🗺 California: #342 of 386,348 inventorsTop 1%
Overall (All Time): #1,957 of 4,157,543Top 1%
251
Patents All Time

Issued Patents All Time

Showing 126–150 of 251 patents

Patent #TitleCo-InventorsDate
6670271 Growing a dual damascene structure using a copper seed layer and a damascene resist structure Michael K. Templeton, Bhanwar Singh, Bharath Rangarajan 2003-12-30
6663723 Vapor drying for cleaning photoresists Michael K. Templeton, Khoi A. Phan, Bharath Rangarajan 2003-12-16
6660645 Process for etching an organic dielectric using a silyated photoresist mask Scott A. Bell, Todd P. Lukanc, Christopher F. Lyons, Marina V. Plat 2003-12-09
6656830 Dual damascene with silicon carbide middle etch stop layer/ARC Dawn Hopper, Fei Wang, Lynne A. Okada 2003-12-02
6656763 Spin on polymers for organic memory devices Jane V. Oglesby, Christopher F. Lyons, Angela T. Hui, Minh Van Ngo, Suzette K. Pangrle 2003-12-02
6654660 Controlling thermal expansion of mask substrates by scatterometry Bhanwar Singh, Christopher F. Lyons, Bharath Rangarajan, Khoi A. Phan 2003-11-25
6653221 Method of forming a ground in SOI structures Bharath Rangarajan, Bhanwar Singh 2003-11-25
6650422 Scatterometry techniques to ascertain asymmetry profile of features and generate a feedback or feedforward process control data associated therewith Bhanwar Singh, Michael K. Templeton, Bharath Rangarajan 2003-11-18
6643604 System for uniformly heating photoresist Michael K. Templeton, Bharath Rangarajan 2003-11-04
6641963 System and method for in situ control of post exposure bake time and temperature Bharath Rangarajan, Michael K. Templeton, Bhanwar Singh 2003-11-04
6634805 Parallel plate development Michael K. Templeton, Khoi A. Phan, Bharath Rangarajan, Bryan K. Choo 2003-10-21
6633392 X-ray reflectance system to determine suitability of SiON ARC layer Bhanwar Singh, Arvind Halliyal 2003-10-14
6632707 Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoning Fei Wang, Lynne A. Okada, James Kai, Calvin T. Gabriel, Lu You 2003-10-14
6632283 System and method for illuminating a semiconductor processing system Bhanwar Singh, Bharath Rangarajan, Khoi A. Phan, Bryan K. Choo 2003-10-14
6630361 Use of scatterometry for in-situ control of gaseous phase chemical trim process Bhanwar Singh, Bharath Rangarajan, Michael K. Templeton, Cristina Cheung 2003-10-07
6629786 Active control of developer time and temperature Bharath Rangarajan, Michael K. Templeton, Bhanwar Singh 2003-10-07
6624642 Metal bridging monitor for etch and CMP endpoint detection Christopher F. Lyons, Steven C. Avanzino 2003-09-23
6622547 System and method for facilitating selection of optimized optical proximity correction Khoi A. Phan, Bhanwar Singh 2003-09-23
6617087 Use of scatterometry to measure pattern accuracy Bharath Rangarajan, Bhanwar Singh 2003-09-09
6613500 Reducing resist residue defects in open area on patterned wafer using trim mask Khoi A. Phan, Bhanwar Singh, Michael K. Templeton, Jeff P. Erhardt 2003-09-02
6605855 CVD plasma process to fill contact hole in damascene process Bhanwar Singh, Michael K. Templeton, Bharath Rangarajan, Christopher F. Lyons, Sanjay K. Yedur 2003-08-12
6605413 Chemical treatment to strengthen photoresists to prevent pattern collapse Christopher F. Lyons 2003-08-12
6605546 Dual bake for BARC fill without voids Wolfram Grundke, Bhanwar Singh, Christopher F. Lyons, Marina V. Plat 2003-08-12
6602727 Scatterometry based active control of exposure conditions Bharath Rangarajan, Bhanwar Singh 2003-08-05
6603206 Slot via filled dual damascene interconnect structure without middle etch stop layer Fei Wang, Lynne A. Okada, Calvin T. Gabriel 2003-08-05