Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more | 2021-11-16 |
| 11164817 | Multi-chip package structures with discrete redistribution layers | Joshua M. Rubin, Steven L. Wright, Lawrence A. Clevenger | 2021-11-02 |
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Paul S. Andry, Yang Liu, Pascale Gagnon, Christian Bergeron, Maryse Cournoyer | 2021-10-05 |
| 11101191 | Laminated circuitry cooling for inter-chip bridges | Hiroyuki Mori | 2021-08-24 |
| 11081424 | Micro-fluidic channels having various critical dimensions | Ravi K. Bonam, Joshua M. Rubin, Iqbal Rashid Saraf, Fee Li Lie | 2021-08-03 |
| 11056418 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie | 2021-07-06 |
| 11049844 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Ravi K. Bonam, Mukta G. Farooq, Dinesh Gupta, James J. Kelly, Joshua M. Rubin | 2021-06-29 |
| 11049789 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie | 2021-06-29 |
| 11035625 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2021-06-15 |
| 10991635 | Multiple chip bridge connector | Dale Curtis McHerron, Joshua M. Rubin, Ravi K. Bonam, Ramachandra Divakaruni, William J. Starke +1 more | 2021-04-27 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz | 2021-04-13 |
| 10948247 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2021-03-16 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2021-03-02 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |