Issued Patents 2019
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522404 | Fully self-aligned via | Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang | 2019-12-31 |
| 10497579 | Water-free etching methods | Zhijun Chen, Lin Xu, Anchuan Wang | 2019-12-03 |
| 10497573 | Selective atomic layer etching of semiconductor materials | Prerna Goradia, Fei Wang, Geetika Bajaj, Zihui Li, Robert Jan Visser +1 more | 2019-12-03 |
| 10490406 | Systems and methods for material breakthrough | Mandar B. Pandit, Mang-Mang Ling, Tom Choi | 2019-11-26 |
| 10490418 | Systems and methods for internal surface conditioning assessment in plasma processing equipment | Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang | 2019-11-26 |
| 10468259 | Charge-trap layer separation and word-line isolation in a 3-D NAND structure | Vinod R. Purayath | 2019-11-05 |
| 10468267 | Water-free etching methods | Zhijun Chen, Lin Xu, Anchuan Wang | 2019-11-05 |
| 10465294 | Oxide and metal removal | Xikun Wang, Jie Liu, Anchuan Wang, Jeffrey W. Anthis, Benjamin Schmiege | 2019-11-05 |
| 10424507 | Fully self-aligned via | Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang | 2019-09-24 |
| 10424485 | Enhanced etching processes using remote plasma sources | Dmitry Lubomirsky, Xinglong Chen, Shankar Venkataraman | 2019-09-24 |
| 10410921 | Fully self-aligned via | Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang | 2019-09-10 |
| 10403507 | Shaped etch profile with oxidation | Tom Choi, Jungmin Ko | 2019-09-03 |
| 10354889 | Non-halogen etching of silicon-containing materials | Tom Choi, Mandar B. Pandit, Mang-Mang Ling | 2019-07-16 |
| 10319603 | Selective SiN lateral recess | Zhijun Chen, Jiayin Huang, Anchuan Wang | 2019-06-11 |
| 10319600 | Thermal silicon etch | Zihui Li, Rui Cheng, Anchuan Wang, Abhijit Basu Mallick | 2019-06-11 |
| 10297458 | Process window widening using coated parts in plasma etch processes | Dongqing Yang, Tien Fak Tan, Peter M. Hillman, Lala Zhu, Dmitry Lubomirsky +2 more | 2019-05-21 |
| 10256112 | Selective tungsten removal | Xikun Wang | 2019-04-09 |
| 10249507 | Methods for selective etching of a silicon material | Zihui Li, Xing-Fu Zhong, Anchuan Wang | 2019-04-02 |
| 10233547 | Methods of etching films with reduced surface roughness | Benjamin Schmiege, Srinivas D. Nemani, Jeffrey W. Anthis, Xikun Wang, Jie Liu +1 more | 2019-03-19 |
| 10204796 | Methods for selective etching of a silicon material using HF gas without nitrogen etchants | Anchuan Wang, Zihui Li, Mikhail Korolik | 2019-02-12 |
| 10170336 | Methods for anisotropic control of selective silicon removal | Zihui Li, Chia-Ling Kao, Anchuan Wang | 2019-01-01 |