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Methods and apparatus for semiconductor package processing |
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Selective atomic layer etching of semiconductor materials |
Fei Wang, Geetika Bajaj, Nitin K. Ingle, Zihui Li, Robert Jan Visser +1 more |
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Uniform crack-free aluminum deposition by two step aluminum electroplating process |
Balaji Ganapathy, Ankur Kadam, Laksheswar Kalita, Tapash Chakraborty, Vijay Bhan Sharma |
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Slurry for polishing of integrated circuit packaging |
Ranga Rao Arnepalli, Prayudi Lianto, Jie Zeng, Arvind Sundarrajan, Robert Jan Visser +1 more |
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Flowable gapfill using solvents |
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2019-05-07 |
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Low vapor pressure aerosol-assisted CVD |
Ranga Rao Arnepalli, Nilesh Chimanrao Bagul, Robert Jan Visser |
2019-04-30 |
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Method for forming yttrium oxide on semiconductor processing equipment |
Laksheswar Kalita, Geetika Bajaj, Yogita Pareek, Yixing Lin, Dmitry Lubomirsky +4 more |
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Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment |
Yogita Pareek, Laksheswar Kalita, Geetika Bajaj, Kevin A. PAPKE, Ankur Kadam +3 more |
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| 10177002 |
Methods for chemical etching of silicon |
Geetika Bajaj, Ravindra Patil, Robert Jan Visser |
2019-01-08 |