Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515927 | Methods and apparatus for semiconductor package processing | Guan Huei See, Arvind Sundarrajan, Ranga Rao Arnepalli, Prerna Goradia | 2019-12-24 |
| 10319601 | Slurry for polishing of integrated circuit packaging | Ranga Rao Arnepalli, Prerna Goradia, Jie Zeng, Arvind Sundarrajan, Robert Jan Visser +1 more | 2019-06-11 |