Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515927 | Methods and apparatus for semiconductor package processing | Prayudi Lianto, Arvind Sundarrajan, Ranga Rao Arnepalli, Prerna Goradia | 2019-12-24 |
| 10475735 | Methods and apparatus for 3D MIM capacitor package processing | Peng Suo, Arvind Sundarrajan | 2019-11-12 |
| 10319601 | Slurry for polishing of integrated circuit packaging | Ranga Rao Arnepalli, Prerna Goradia, Prayudi Lianto, Jie Zeng, Arvind Sundarrajan +1 more | 2019-06-11 |
| 10276424 | Method and apparatus for wafer level packaging | Yu Gu, Arvind Sundarrajan | 2019-04-30 |
| 10229827 | Method of redistribution layer formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Yu Gu, Arvind Sundarrajan | 2019-03-12 |
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Yu Gu, Arvind Sundarrajan +3 more | 2019-02-19 |