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Fully self-aligned via |
Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang |
2019-12-31 |
| 10497579 |
Water-free etching methods |
Zhijun Chen, Lin Xu, Anchuan Wang |
2019-12-03 |
| 10497573 |
Selective atomic layer etching of semiconductor materials |
Prerna Goradia, Fei Wang, Geetika Bajaj, Zihui Li, Robert Jan Visser +1 more |
2019-12-03 |
| 10490406 |
Systems and methods for material breakthrough |
Mandar B. Pandit, Mang-Mang Ling, Tom Choi |
2019-11-26 |
| 10490418 |
Systems and methods for internal surface conditioning assessment in plasma processing equipment |
Soonam Park, Yufei Zhu, Edwin C. Suarez, Dmitry Lubomirsky, Jiayin Huang |
2019-11-26 |
| 10468259 |
Charge-trap layer separation and word-line isolation in a 3-D NAND structure |
Vinod R. Purayath |
2019-11-05 |
| 10468267 |
Water-free etching methods |
Zhijun Chen, Lin Xu, Anchuan Wang |
2019-11-05 |
| 10465294 |
Oxide and metal removal |
Xikun Wang, Jie Liu, Anchuan Wang, Jeffrey W. Anthis, Benjamin Schmiege |
2019-11-05 |
| 10424507 |
Fully self-aligned via |
Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang |
2019-09-24 |
| 10424485 |
Enhanced etching processes using remote plasma sources |
Dmitry Lubomirsky, Xinglong Chen, Shankar Venkataraman |
2019-09-24 |
| 10410921 |
Fully self-aligned via |
Ying Zhang, Abhijit Basu Mallick, Regina Freed, Uday Mitra, Ho-yung David Hwang |
2019-09-10 |
| 10403507 |
Shaped etch profile with oxidation |
Tom Choi, Jungmin Ko |
2019-09-03 |
| 10354889 |
Non-halogen etching of silicon-containing materials |
Tom Choi, Mandar B. Pandit, Mang-Mang Ling |
2019-07-16 |
| 10319603 |
Selective SiN lateral recess |
Zhijun Chen, Jiayin Huang, Anchuan Wang |
2019-06-11 |
| 10319600 |
Thermal silicon etch |
Zihui Li, Rui Cheng, Anchuan Wang, Abhijit Basu Mallick |
2019-06-11 |
| 10297458 |
Process window widening using coated parts in plasma etch processes |
Dongqing Yang, Tien Fak Tan, Peter M. Hillman, Lala Zhu, Dmitry Lubomirsky +2 more |
2019-05-21 |
| 10256112 |
Selective tungsten removal |
Xikun Wang |
2019-04-09 |
| 10249507 |
Methods for selective etching of a silicon material |
Zihui Li, Xing-Fu Zhong, Anchuan Wang |
2019-04-02 |
| 10233547 |
Methods of etching films with reduced surface roughness |
Benjamin Schmiege, Srinivas D. Nemani, Jeffrey W. Anthis, Xikun Wang, Jie Liu +1 more |
2019-03-19 |
| 10204796 |
Methods for selective etching of a silicon material using HF gas without nitrogen etchants |
Anchuan Wang, Zihui Li, Mikhail Korolik |
2019-02-12 |
| 10170336 |
Methods for anisotropic control of selective silicon removal |
Zihui Li, Chia-Ling Kao, Anchuan Wang |
2019-01-01 |
