| 10497579 |
Water-free etching methods |
Zhijun Chen, Lin Xu, Nitin K. Ingle |
2019-12-03 |
| 10468267 |
Water-free etching methods |
Zhijun Chen, Lin Xu, Nitin K. Ingle |
2019-11-05 |
| 10465294 |
Oxide and metal removal |
Xikun Wang, Jie Liu, Nitin K. Ingle, Jeffrey W. Anthis, Benjamin Schmiege |
2019-11-05 |
| 10424463 |
Oxide etch selectivity systems and methods |
Lin Xu, Zhijun Chen, Son T. Nguyen |
2019-09-24 |
| 10424464 |
Oxide etch selectivity systems and methods |
Lin Xu, Zhijun Chen, Son T. Nguyen |
2019-09-24 |
| 10319600 |
Thermal silicon etch |
Zihui Li, Rui Cheng, Nitin K. Ingle, Abhijit Basu Mallick |
2019-06-11 |
| 10319603 |
Selective SiN lateral recess |
Zhijun Chen, Jiayin Huang, Nitin K. Ingle |
2019-06-11 |
| 10283324 |
Oxygen treatment for nitride etching |
Zhijun Chen, Jiayin Huang |
2019-05-07 |
| 10249507 |
Methods for selective etching of a silicon material |
Zihui Li, Xing-Fu Zhong, Nitin K. Ingle |
2019-04-02 |
| 10204796 |
Methods for selective etching of a silicon material using HF gas without nitrogen etchants |
Nitin K. Ingle, Zihui Li, Mikhail Korolik |
2019-02-12 |
| 10204795 |
Flow distribution plate for surface fluorine reduction |
Jiayin Huang, Lin Xu, Zhijun Chen |
2019-02-12 |
| 10186428 |
Removal methods for high aspect ratio structures |
Lin Xu, Zhijun Chen, Jiayin Huang |
2019-01-22 |
| 10170336 |
Methods for anisotropic control of selective silicon removal |
Zihui Li, Chia-Ling Kao, Nitin K. Ingle |
2019-01-01 |
