| 9528185 |
Plasma uniformity control by arrays of unit cell plasmas |
Sang Ki Nam, Tae Seung Cho, Ludovic Godet |
2016-12-27 |
| 9530674 |
Method and system for three-dimensional (3D) structure fill |
Ellie Yieh, Ludovic Godet, Er-Xuan Ping, Gary E. Dickerson |
2016-12-27 |
| 9514953 |
Methods for barrier layer removal |
Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, He Ren, Mehul Naik |
2016-12-06 |
| 9515166 |
Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3D structure semiconductor applications |
Ellie Yieh, Ludovic Godet, Yin Fan |
2016-12-06 |
| 9508561 |
Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications |
Mehul Naik, Takehito Koshizawa, He Ren |
2016-11-29 |
| 9484202 |
Apparatus and methods for spacer deposition and selective removal in an advanced patterning process |
Jie Zhou, Chentsau Ying, Shambhu N. Roy, Jingjing Liu, Ellie Yieh |
2016-11-01 |
| 9478433 |
Cyclic spacer etching process with improved profile control |
Qingjun Zhou, Jungmin Ko, Tom Choi, Sean S. Kang, Jeremiah T. Pender +1 more |
2016-10-25 |
| 9412613 |
Development of high etch selective hardmask material by ion implantation into amorphous carbon films |
Pramit Manna, Abhijit Basu Mallick, Ludovic Godet, Yongmei Chen, Jun Xue +2 more |
2016-08-09 |
| 9406522 |
Single platform, multiple cycle spacer deposition and etch |
Hao Chen, Chentsau Ying, Ellie Yieh |
2016-08-02 |
| 9385219 |
Method and apparatus for selective deposition |
Ellie Yieh, Ludovic Godet, Yin Fan, Tristan Y. Ma |
2016-07-05 |
| 9385028 |
Air gap process |
Takehito Koshizawa |
2016-07-05 |
| 9379021 |
Method to reduce K value of dielectric layer for advanced FinFET formation |
Ellie Yieh, Ludovic Godet |
2016-06-28 |
| 9368448 |
Metal-containing films as dielectric capping barrier for advanced interconnects |
Yihong Chen, Abhijit Basu Mallick, Mehul Naik |
2016-06-14 |
| 9368370 |
Temperature ramping using gas distribution plate heat |
Sergey G. Belostotskiy, Chinh Dinh, Qingjun Zhou, Andrew Nguyen |
2016-06-14 |
| 9305796 |
Methods for etching silicon using hydrogen radicals in a hot wire chemical vapor deposition chamber |
Sukti Chatterjee |
2016-04-05 |
| 9299577 |
Methods for etching a dielectric barrier layer in a dual damascene structure |
He Ren, Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Mehul Naik |
2016-03-29 |
| 9287095 |
Semiconductor system assemblies and methods of operation |
Andrew Nguyen, Kartik Ramaswamy, Bradley J. Howard, Yogananda Sarode Vishwanath |
2016-03-15 |
| 9269590 |
Spacer formation |
Olivier Luere, Sean S. Kang |
2016-02-23 |
| 9257330 |
Ultra-thin structure to protect copper and method of preparation |
Amit Chatterjee, Geetika Bajaj, Pramit Manna, He Ren, Tapash Chakraborty +3 more |
2016-02-09 |
