| 9514932 |
Flowable carbon for semiconductor processing |
Nitin K. Ingle |
2016-12-06 |
| 9508545 |
Selectively lateral growth of silicon oxide thin film |
Yihong Chen, Kelvin Chan, Shaunak Mukherjee |
2016-11-29 |
| 9417515 |
Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor |
Soumendra N. Barman, Cara Beasley, Ralf Hofmann, Nitin K. Ingle |
2016-08-16 |
| 9412613 |
Development of high etch selective hardmask material by ion implantation into amorphous carbon films |
Pramit Manna, Ludovic Godet, Yongmei Chen, Jun Xue, Mukund Srinivasan +2 more |
2016-08-09 |
| 9406509 |
Deposition of heteroatom-doped carbon films |
Pramit Manna, Mukund Srinivasan |
2016-08-02 |
| 9390914 |
Wet oxidation process performed on a dielectric material formed from a flowable CVD process |
Linlin Wang, Nitin K. Ingle |
2016-07-12 |
| 9384950 |
Chamber coatings |
Ren-Guan Duan, Juan Carlos Rocha-Alvarez, Jianhua Zhou, Ningli Liu, Yihong Chen +1 more |
2016-07-05 |
| 9368448 |
Metal-containing films as dielectric capping barrier for advanced interconnects |
Yihong Chen, Mehul Naik, Srinivas D. Nemani |
2016-06-14 |
| 9362107 |
Flowable low-k dielectric gapfill treatment |
Kiran V. Thadani, Sanjay Kamath |
2016-06-07 |
| 9343293 |
Flowable silicon—carbon—oxygen layers for semiconductor processing |
Brian Saxton Underwood, Nitin K. Ingle |
2016-05-17 |
| 9318383 |
Integrated cluster to enable next generation interconnect |
Mehul Naik, Kiran V. Thadani, Zhenjiang Cui |
2016-04-19 |
| 9257330 |
Ultra-thin structure to protect copper and method of preparation |
Amit Chatterjee, Geetika Bajaj, Pramit Manna, He Ren, Tapash Chakraborty +3 more |
2016-02-09 |
