| 9514953 |
Methods for barrier layer removal |
Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, He Ren |
2016-12-06 |
| 9508561 |
Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications |
Srinivas D. Nemani, Takehito Koshizawa, He Ren |
2016-11-29 |
| 9437479 |
Methods for forming an interconnect pattern on a substrate |
Suketu Arun Parikh |
2016-09-06 |
| 9425092 |
Methods for producing interconnects in semiconductor devices |
Ismail Emesh, Roey Shaviv |
2016-08-23 |
| 9368448 |
Metal-containing films as dielectric capping barrier for advanced interconnects |
Yihong Chen, Abhijit Basu Mallick, Srinivas D. Nemani |
2016-06-14 |
| 9337051 |
Method for critical dimension reduction using conformal carbon films |
Bencherki Mebarki, Bok Hoen Kim, Deenesh Padhi, Li Yan Miao, Pramit Manna +4 more |
2016-05-10 |
| 9318383 |
Integrated cluster to enable next generation interconnect |
Abhijit Basu Mallick, Kiran V. Thadani, Zhenjiang Cui |
2016-04-19 |
| 9312168 |
Air gap structure integration using a processing system |
He Ren, Zhenjiang Cui |
2016-04-12 |
| 9305831 |
Integrated metal spacer and air gap interconnect |
He Ren |
2016-04-05 |
| 9299605 |
Methods for forming passivation protection for an interconnection structure |
He Ren, Yong Cao, Sree Rangasai V. Kesapragada, Mei-Yee Shek, Yana Cheng |
2016-03-29 |
| 9299577 |
Methods for etching a dielectric barrier layer in a dual damascene structure |
He Ren, Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani |
2016-03-29 |
| 9269563 |
Methods for forming interconnect structure utilizing selective protection process for hardmask removal process |
He Ren |
2016-02-23 |
| 9257330 |
Ultra-thin structure to protect copper and method of preparation |
Amit Chatterjee, Geetika Bajaj, Pramit Manna, He Ren, Tapash Chakraborty +3 more |
2016-02-09 |
