He Ren — 9 Patents at Applied Materials

Issued Patents 2016

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9514953	Methods for barrier layer removal	Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, Mehul Naik	2016-12-06	$23,225,000
9508561	Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications	Mehul Naik, Srinivas D. Nemani, Takehito Koshizawa	2016-11-29	$13,456,000
9384997	Dry-etch selectivity	Jang-Gyoo Yang, Jonghoon Baek, Anchuan Wang, Soonam Park, Saurabh Garg +2 more	2016-07-05	$10,411,000
9312168	Air gap structure integration using a processing system	Mehul Naik, Zhenjiang Cui	2016-04-12	$12,337,000
9305831	Integrated metal spacer and air gap interconnect	Mehul Naik	2016-04-05	$9,374,000
9299605	Methods for forming passivation protection for an interconnection structure	Mehul Naik, Yong Cao, Sree Rangasai V. Kesapragada, Mei-Yee Shek, Yana Cheng	2016-03-29	$6,414,000
9299577	Methods for etching a dielectric barrier layer in a dual damascene structure	Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, Mehul Naik	2016-03-29	$6,414,000
9269563	Methods for forming interconnect structure utilizing selective protection process for hardmask removal process	Mehul Naik	2016-02-23	$9,765,000
9257330	Ultra-thin structure to protect copper and method of preparation	Amit Chatterjee, Geetika Bajaj, Pramit Manna, Tapash Chakraborty, Srinivas D. Nemani +3 more	2016-02-09	$18,126,000