Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514953 | Methods for barrier layer removal | Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, Mehul Naik | 2016-12-06 |
| 9508561 | Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications | Mehul Naik, Srinivas D. Nemani, Takehito Koshizawa | 2016-11-29 |
| 9384997 | Dry-etch selectivity | Jang-Gyoo Yang, Jonghoon Baek, Anchuan Wang, Soonam Park, Saurabh Garg +2 more | 2016-07-05 |
| 9312168 | Air gap structure integration using a processing system | Mehul Naik, Zhenjiang Cui | 2016-04-12 |
| 9305831 | Integrated metal spacer and air gap interconnect | Mehul Naik | 2016-04-05 |
| 9299605 | Methods for forming passivation protection for an interconnection structure | Mehul Naik, Yong Cao, Sree Rangasai V. Kesapragada, Mei-Yee Shek, Yana Cheng | 2016-03-29 |
| 9299577 | Methods for etching a dielectric barrier layer in a dual damascene structure | Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, Mehul Naik | 2016-03-29 |
| 9269563 | Methods for forming interconnect structure utilizing selective protection process for hardmask removal process | Mehul Naik | 2016-02-23 |
| 9257330 | Ultra-thin structure to protect copper and method of preparation | Amit Chatterjee, Geetika Bajaj, Pramit Manna, Tapash Chakraborty, Srinivas D. Nemani +3 more | 2016-02-09 |