| 9514953 |
Methods for barrier layer removal |
Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, Mehul Naik |
2016-12-06 |
| 9508561 |
Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications |
Mehul Naik, Srinivas D. Nemani, Takehito Koshizawa |
2016-11-29 |
| 9384997 |
Dry-etch selectivity |
Jang-Gyoo Yang, Jonghoon Baek, Anchuan Wang, Soonam Park, Saurabh Garg +2 more |
2016-07-05 |
| 9312168 |
Air gap structure integration using a processing system |
Mehul Naik, Zhenjiang Cui |
2016-04-12 |
| 9305831 |
Integrated metal spacer and air gap interconnect |
Mehul Naik |
2016-04-05 |
| 9299605 |
Methods for forming passivation protection for an interconnection structure |
Mehul Naik, Yong Cao, Sree Rangasai V. Kesapragada, Mei-Yee Shek, Yana Cheng |
2016-03-29 |
| 9299577 |
Methods for etching a dielectric barrier layer in a dual damascene structure |
Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, Mehul Naik |
2016-03-29 |
| 9269563 |
Methods for forming interconnect structure utilizing selective protection process for hardmask removal process |
Mehul Naik |
2016-02-23 |
| 9257330 |
Ultra-thin structure to protect copper and method of preparation |
Amit Chatterjee, Geetika Bajaj, Pramit Manna, Tapash Chakraborty, Srinivas D. Nemani +3 more |
2016-02-09 |
