Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications

Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications

US Patent 9508561 · Granted Nov 29, 2016

Estimated economic value: $13,456,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pulsed plasma (DC/RF) deposition of high quality C films for patterning2025
Processes for depositing SiB films2025
Method for forming integrated circuit structures2025
Directional selective fill for silicon gap fill processes2025
Directional selective deposition2025
Integration processes utilizing boron-doped silicon materials2025
Forming films with improved film quality2025
Ultra high-k hafnium oxide and hafnium zirconium oxide films2025
Methods and apparatus for carbon compound film deposition2025
Metal based hydrogen barrier2025
Monolithic complementary field-effect transistors having carbon-doped release la2025
Metal oxide resist patterning with electrical field guided post-exposure bake2025